Supported Journals:
PhotoniX、Optical Engineering (SCI)、Journal of Micro/Nanolithography、MEMS、and MOEMS (SCI)、Photonic Sensors (SCI)、Opto-Electronic Advances(OEA)（SCI）、《信息与电子工程前沿（英文）》（FITEE）（SCI）、International Journal of Extreme Manufacturing（Ei）、《红外与激光工程》(Ei)、《中国光学》（ESCI、Ei）、《光子学报》（ESCI、Ei）、《光学精密工程》（Ei）、SPIE Proceedings（Ei）、《光电工程》（中文核心）etc.
SPIE Proceeding:
See more information as following:
Proceedings of SPIE (EI, Scopus, Web of Science)
Present your research at the conference and publish a paper of four or more pages on your findings in the Proceedings to ensure that your work is peer reviewed by experts in your field, indexed by the major indexes and search engines, and available to researchers around the world soon after the conference. This will enable your community to have a snapshot of the state of your research at the time of the conference.
SPIE, the international society of optics and photonics, will publish these papers in the Proceedings of SPIE on theSPIE Digital Library, the world’s largest collection of optics and photonics applied research, with more than 450,000 papers.
This will enable researchers around the world to know about, read, and cite your on-going research soon after the conference. The Proceedings will provide a long-term record of the research presented at the conference so that you may expand your relationships with others in your field.
Ei Compendex, Scopus, and Web of Science, and other major scientific and engineering indexes, and all of the main search engines cover Proceedings of SPIE papers.
Guidelines for Submitting to Conference
By submitting an abstract, I agree to the following conditions:
An author or coauthor (including keynote, invited, oral, and poster presenters) will do all of the following:
1.Register at conference website.
2.Attend the conference.
3.Make the presentation as scheduled in the program.
4.Submit a manuscript of four or more pages for publication in the conference proceedings.
After publishing the conference paper in the proceedings, you may submit an expanded manuscript to any journal, including one of the cooperating journals. Please see more information at: SPIE copyright transfer allows an author to expand a conference paper published in the Proceedings of SPIE and submit it to a journal. If your work is almost ready for a journal article, first submit it to the Proceedings and then submit the expanded manuscript to an appropriate journal once it is complete.
SPIE policy allows a researcher to submit a conference paper to an SPIE journal, either with no changes if it is truly ready for one of the SPIE journal sor with changes that make the manuscript ready for an SPIE journal.
See more information at:
http://spie.org/conferences-and-exhibitions/authors-and-presenters/format-your-manuscript-multimedia-files-and-references#Sample
《Micromachines》(SCI)
Special Issue : Design and Manufacture of Micro Optical Lens
A wide range of components is used in micro-optics, such as micro-lenses and miniature diffractive and adaptive optical elements in mechatronics products, precision instruments and micromachines. Applications include miniature imaging lens, optical fibers, lens for endoscopy and naked eye 3D display, laser beam shaping, etc.
Glass is the first material used for optical devices. Advances in polymer optics have dominated the consumer markets. The need for higher imaging quality and environmental endurance, together with the advances in manufacturing technology and machine design, lead to the comeback of glass for critical lens applications. The advances in fabrication technology, materials technology, control and automation and the miniaturization of machines have made the automatic production of high precision glass lens accessible to more manufacturers.
We are inviting papers from technology reviews to original and theoretical research works, on all aspects of microlens manufacture. These are not limited to molding technology, but also include various fabrication techniques such as precision machining and polishing, rapid
prototyping, and lithography, etc.
