Important Dates
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Abstract Submission Deadline: 31 May 2023
Early-bird Registration Deadline: 23 July 2023
Registration Deadline: 10 August 2023
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To further promote the technological exchange, industrial chain cooperation and talent cultivation in photonic IC fields, "Forum on Photonic Integrated Circuits 2023" will be held in Xiamen, Fujian Province, China on August 12-17, 2023. Over 200 top-class experts and scholars at home and abroad will be invited to discuss the latest progress of integrated photonics technologies and applications. There will also be interesting activities such as PIC Training, Panel Discussions, Tutorials, Special Session for International Corporation, PIC Platform Exhibition, Young Entrepreneur Forum, and Talent Recruitment to provide participants with frontier ideas and cutting-edge information, as well as professional development opportunities for enterprises, scientific researchers, teachers and students.
Welcome to this wonderful party!
For Conference Invitation Letter, please contact zhangjie@csoe.org.cn.
Welcome to this wonderful party!
For Conference Invitation Letter, please contact zhangjie@csoe.org.cn.
Committee
Host
Chinese Society for Optical Engineering (CSOE)
Xiamen Science and Technology Bureau
Organizers
FPIC Committee of CSOE
Xiamen University, China
SAN-U Co., Ltd., China
Shandong University, China
Fujian Normal University, China
Fujian Optical Society
Co-Organizers
National Optoelectronics Innovation Center
Hisilicon Co., Ltd., China
Cooperative Media
Honorary Chairs
Qiming Wang, Institute of Semiconductors, CAS, China
Lianghui Chen, Institute of Semiconductors, CAS, China
General Chairs
Yueguang Lv, Chinese Academy of Engineering, China
Shaohua Yu, Pengcheng Laboratory, China
General Co-Chairs
Jiangxing Wu, Chinese Academy of Engineering, China
Shining Zhu, Nanjing University, China
Min Gu, University of Shanghai for Science and Technology, China
Huilin Jiang, Changchun University of Science and Technology, China
Deren Yang, Zhejiang University, China
Xiangang Luo, Institute of Optics and Electronics, CAS, China
Fengyi Jiang, Nanchang University, China
Tiejun Cui, Southeast University, China
Ninghua Zhu, Institute of Semiconductors, CAS, China
Yi Luo, Tsinghua University, China
Executive Chairs
Ling Li, SAN-U Co., Ltd., China
Ming Li, Institute of Semiconductors, CAS, China
Weiping Huang, Hisense Broadband, China
TPC Chairs
Yikai Su, Shanghai Jiao Tong University, China
Zhong Chen, Xiamen University, China
TPC Co-Chairs
Zhangyuan Chen, Peking University, China
Jiangwei Man, Hisilicon Co., Ltd., China
Xiaodi Tan, Fujian Normal University, China
Xi Xiao, National Optoelectronics Innovation Center, China
Kun Xu, Beijing University of Posts and Telecommunications, China
Chunlai Xue, Institute of Semiconductors, CAS, China
Jianyi Yang, Zhejiang University, China
Mingbin Yu, SIMIT, China
Li Zeng, Huawei, China
Jia Zhao, Shandong University, China
Xiaoping Zheng, Tsinghua University, China
Sub-Conferences
1. Frontier Optoelectronic Devices and Integration
Chairs
Yikai Su, Shanghai Jiao Tong University, China
Daoxin Dai, Zhejiang University, China
Xiaoyong Hu, Peking University, China
TPC Members
Jin Liu, Sun Yat-sen University, China
Cuicui Lu, Beijing Institute of Technology, China
Renmin Ma, Peking University, China
Jian Wang, Huazhong University of Science and Technology, China
Ke Xu, Harbin Institute of Technology, Shenzhen, China
2. Optoelectronic and Microelectronic Integrated Processing
Chairs
Mingbin Yu, SIMIT, CAS, China
Junbo Feng, CUMEC, China
TPC Members
Wei Jiang, Nanjing University, China
Zhihua Li, Institute of Microelectronics, CAS, China
Yu Liu, Institute of Semiconductors, CAS, China
Hui Su, Litecore, China
Yuanda Wu, Shijia Photons, China
Yong Zhang, Shanghai Jiao Tong University, China
3. Optoelectronic and Microelectronic Integrated Simulation and Design
Chairs
Jia Zhao, Shandong University, China
Vivian Yang, DAWNSEMI Co., China
Wenfu Zhang, Xi'an Institute of Optics and Precision Mechanics, CAS, China
TPC Members
Wenchao Chen, Zhejiang University, China
Xiaoming Liu, Empyrean, China
Zhigang Song, Institute of Semiconductors, CAS, China
Site Zhang, CIOMP, CAS, China
4. Optoelectronic Integrated Chip Packaging and Testing
Chairs
Xi Xiao, National Optoelectronics Innovation Center, China
Jiangwei Man, Hisilicon Co., Ltd., China
Shangjian Zhang, University of Electronic Science and Technology of China, China
Fengman Liu, Institute of Microelectronics, CAS, China
TPC Members
Yanfeng Fu, National Optoelectronics Innovation Center, China
Lei Hu, Tecent, China
Zhiming Liu, Ceyear Technologies Co., Ltd. China
Lei Wang, Pengcheng Laboratory, China
Xin Wang, Institute of Semiconductors, CAS, China
Bo Zhang, Accelink Technologies, China
5. Optical Communication and Data Center Application
Chairs
Junjie Li, China Telecom, China
Chongjin Xie, Alibaba, China
TPC Members
Fangchao Li, Tecent, China
Liangchuan Li, Huawei, China
Shikui Shen, China Unicom, China
Ming Tang, Huazhong University of Science and Technology, China
Hua Zhang, Hisense Broadband, China
6. Novel Optical Communication Chips
Chairs
Nan Chi, Fudan University, China
Wei Chen, Institute of Semiconductors, CAS, China
TPC Members
Guoqiang Li, South China University of Technology, China
Qinggui Tan, Chinese Academy of Space Technology, China
Ruijun Wang, Sun Yat-sen University, China
Wei Wang, Xi'an Institute of Optics and Precision Mechanics, CAS, China
Junping Zhang, Huawei, China
Liang Zhang, Shanghai Institute of Technical Physics, CAS, China
7. Electrical Chips for Optical Modules
Chairs
Nan Qi, Institute of Semiconductors, CAS, China
Fang Shi, PhotonIC Technologies Co., China
TPC Members
Tao Chen, Sibroad Co., China
Dan Li, Xi'an Jiaotong University, China
Ke Li, Pengcheng Laboratory, China
Yonghui Lin, UX Fastic Co., China
Zuodong Wang, Wingcomm Technologies Co., China
8. Nano Manufacturing and Equipment
Chairs
Baoshun Zhang, SINANO, CAS, China
Hui Su, Fujian Z.K. Litecore Co., Ltd. China
TPC Members
Xiangfei Chen, Nanjing University, China
Dan Lu, Institute of Semiconductors, CAS, China
Weibin Qiu, Huaqiao University, China
Jianwei Wang, InnoLight, China
Yongqiang Ning, CIOMP, CAS, China
9. Smart Optical Computing
Chairs
Yichen Shen, Lightelligence, China
Xiaowen Dong, Huawei, China
Jianji Dong, Huazhong University of Science and Technology, China
TPC Members
Bing Bai, Photoncounts Co., China
Tangsheng Cheng, Ultrastarventures Co., China
Xue Feng, Tsinghua University, China
Shuming Jiao, Pengcheng Laboratory, China
Shuiying Xiang, Xidian University, China
10. Optical Quantum Devices and Systems
Chairs
Jianwei Wang, Peking University, China
Xifeng Ren, University of Science and Technology of China, China
TPC Members
Chunhua Dong, University of Science and Technology of China, China
Feng Liu, Zhejiang University, China
Xiaogang Qiang, National Innovation Institute of Defense Technology, AMS, China
Xiaolong Su, Shanxi University, China
Qingyuan Zhao, Nanjing University, China
11. Multidimensional Optical Storage
Chairs
Qiming Zhang, Shanghai University of Technology, China
Xiao Lin, Fujian Normal University, China
Jijun Zhang, Hualu Group, China
TPC Members
Qidai Chen, Jilin University, China
Xiangping Li, Jinan University, China
Jianrong Qiu, Zhejiang University, China
Xiaodi Tan, Fujian Normal University, China
Changsheng Xie, Huazhong University of Science and Technology, China
Yong Zhang, Hualu Group, China
12. Optical Imaging and Display
Chairs
Jiangtao Xu, Tianjin University, China
Liangcai Cao, Tsinghua University, China
Lingling Huang, Beijing Institute of Technology, China
TPC Members
Kun Huang, University of Science and Technology of China, China
Tao Li, Nanjing University, China
Changju Liu, CETC Chongqing Acoustic-Optic-Electronic Co., Ltd., China
Liyuan Liu, Institute of Semiconductors, CAS, China
Xinzhu Sang, Beijing University of Posts and Telecommunications, China
Qionghua Wang, Beihang University, China
Lian Duan, Tsinghua University, China
Wen Qiao, Suzhou University, China
Qionghua Wang, Beihang University, China
Qun Yan, Fuzhou University, China
Zhenrong Zheng, Zhejiang University, China
13. Microwave Photonic Integration
Chairs
Shilong Pan, Nanjing University of Aeronautics and Astronautics, China
Tao Zhou, CETC 29, China
TPC Members
Tengfei Hao, Institute of Semiconductors, CAS, China
Pengfei Qu, CETC 44, China
Weifeng Zhang, Beijing Institute of Technology, China
Xin Zhong, CETC 29, China
Zixing Zhu, Air Force Engineering University, China
Xihua Zou, Southwest Jiaotong University, China
14. Lidar
Chairs
Li Zeng, Huawei, China
Minghua Chen, Tsinghua University, China
Jiaoqing Pan, Institute of Semiconductors, CAS, China
TPC Members
Yongqiang Ning, CIOMP, CAS, China
Chunhui Wang, Harbin Institute of Technology, China
Shaofeng Zhang, Hitronics Technologies, China
Li Zhao, Vertilite, China
Yiqiang Zhao, Tianjin University, China
Zhangming Zhu, Xidian University, China
15. Optical Sensing
Chairs
Tao Zhu, Chongqing University, China
Xiaopeng Dong, Xiamen University, China
TPC Members
Qun Hao, Beijing Institute of Technology, China
Fufei Pang, Shanghai University, China
Yidong Tan, Tsinghua University, China
Anbang Wang, Guangdong University of Technology, China
Xiaoji Zhou, Peking University, China
Chinese Society for Optical Engineering (CSOE)
Xiamen Science and Technology Bureau
Organizers
FPIC Committee of CSOE
Xiamen University, China
SAN-U Co., Ltd., China
Shandong University, China
Fujian Normal University, China
Fujian Optical Society
Co-Organizers
National Optoelectronics Innovation Center
Hisilicon Co., Ltd., China
Cooperative Media
Honorary Chairs
Qiming Wang, Institute of Semiconductors, CAS, China
Lianghui Chen, Institute of Semiconductors, CAS, China
General Chairs
Yueguang Lv, Chinese Academy of Engineering, China
Shaohua Yu, Pengcheng Laboratory, China
General Co-Chairs
Jiangxing Wu, Chinese Academy of Engineering, China
Shining Zhu, Nanjing University, China
Min Gu, University of Shanghai for Science and Technology, China
Huilin Jiang, Changchun University of Science and Technology, China
Deren Yang, Zhejiang University, China
Xiangang Luo, Institute of Optics and Electronics, CAS, China
Fengyi Jiang, Nanchang University, China
Tiejun Cui, Southeast University, China
Ninghua Zhu, Institute of Semiconductors, CAS, China
Yi Luo, Tsinghua University, China
Executive Chairs
Ling Li, SAN-U Co., Ltd., China
Ming Li, Institute of Semiconductors, CAS, China
Weiping Huang, Hisense Broadband, China
TPC Chairs
Yikai Su, Shanghai Jiao Tong University, China
Zhong Chen, Xiamen University, China
TPC Co-Chairs
Zhangyuan Chen, Peking University, China
Jiangwei Man, Hisilicon Co., Ltd., China
Xiaodi Tan, Fujian Normal University, China
Xi Xiao, National Optoelectronics Innovation Center, China
Kun Xu, Beijing University of Posts and Telecommunications, China
Chunlai Xue, Institute of Semiconductors, CAS, China
Jianyi Yang, Zhejiang University, China
Mingbin Yu, SIMIT, China
Li Zeng, Huawei, China
Jia Zhao, Shandong University, China
Xiaoping Zheng, Tsinghua University, China
Sub-Conferences
1. Frontier Optoelectronic Devices and Integration
Chairs
Yikai Su, Shanghai Jiao Tong University, China
Daoxin Dai, Zhejiang University, China
Xiaoyong Hu, Peking University, China
TPC Members
Jin Liu, Sun Yat-sen University, China
Cuicui Lu, Beijing Institute of Technology, China
Renmin Ma, Peking University, China
Jian Wang, Huazhong University of Science and Technology, China
Ke Xu, Harbin Institute of Technology, Shenzhen, China
2. Optoelectronic and Microelectronic Integrated Processing
Chairs
Mingbin Yu, SIMIT, CAS, China
Junbo Feng, CUMEC, China
TPC Members
Wei Jiang, Nanjing University, China
Zhihua Li, Institute of Microelectronics, CAS, China
Yu Liu, Institute of Semiconductors, CAS, China
Hui Su, Litecore, China
Yuanda Wu, Shijia Photons, China
Yong Zhang, Shanghai Jiao Tong University, China
3. Optoelectronic and Microelectronic Integrated Simulation and Design
Chairs
Jia Zhao, Shandong University, China
Vivian Yang, DAWNSEMI Co., China
Wenfu Zhang, Xi'an Institute of Optics and Precision Mechanics, CAS, China
TPC Members
Wenchao Chen, Zhejiang University, China
Xiaoming Liu, Empyrean, China
Zhigang Song, Institute of Semiconductors, CAS, China
Site Zhang, CIOMP, CAS, China
4. Optoelectronic Integrated Chip Packaging and Testing
Chairs
Xi Xiao, National Optoelectronics Innovation Center, China
Jiangwei Man, Hisilicon Co., Ltd., China
Shangjian Zhang, University of Electronic Science and Technology of China, China
Fengman Liu, Institute of Microelectronics, CAS, China
TPC Members
Yanfeng Fu, National Optoelectronics Innovation Center, China
Lei Hu, Tecent, China
Zhiming Liu, Ceyear Technologies Co., Ltd. China
Lei Wang, Pengcheng Laboratory, China
Xin Wang, Institute of Semiconductors, CAS, China
Bo Zhang, Accelink Technologies, China
5. Optical Communication and Data Center Application
Chairs
Junjie Li, China Telecom, China
Chongjin Xie, Alibaba, China
TPC Members
Fangchao Li, Tecent, China
Liangchuan Li, Huawei, China
Shikui Shen, China Unicom, China
Ming Tang, Huazhong University of Science and Technology, China
Hua Zhang, Hisense Broadband, China
6. Novel Optical Communication Chips
Chairs
Nan Chi, Fudan University, China
Wei Chen, Institute of Semiconductors, CAS, China
TPC Members
Guoqiang Li, South China University of Technology, China
Qinggui Tan, Chinese Academy of Space Technology, China
Ruijun Wang, Sun Yat-sen University, China
Wei Wang, Xi'an Institute of Optics and Precision Mechanics, CAS, China
Junping Zhang, Huawei, China
Liang Zhang, Shanghai Institute of Technical Physics, CAS, China
7. Electrical Chips for Optical Modules
Chairs
Nan Qi, Institute of Semiconductors, CAS, China
Fang Shi, PhotonIC Technologies Co., China
TPC Members
Tao Chen, Sibroad Co., China
Dan Li, Xi'an Jiaotong University, China
Ke Li, Pengcheng Laboratory, China
Yonghui Lin, UX Fastic Co., China
Zuodong Wang, Wingcomm Technologies Co., China
8. Nano Manufacturing and Equipment
Chairs
Baoshun Zhang, SINANO, CAS, China
Hui Su, Fujian Z.K. Litecore Co., Ltd. China
TPC Members
Xiangfei Chen, Nanjing University, China
Dan Lu, Institute of Semiconductors, CAS, China
Weibin Qiu, Huaqiao University, China
Jianwei Wang, InnoLight, China
Yongqiang Ning, CIOMP, CAS, China
9. Smart Optical Computing
Chairs
Yichen Shen, Lightelligence, China
Xiaowen Dong, Huawei, China
Jianji Dong, Huazhong University of Science and Technology, China
TPC Members
Bing Bai, Photoncounts Co., China
Tangsheng Cheng, Ultrastarventures Co., China
Xue Feng, Tsinghua University, China
Shuming Jiao, Pengcheng Laboratory, China
Shuiying Xiang, Xidian University, China
10. Optical Quantum Devices and Systems
Chairs
Jianwei Wang, Peking University, China
Xifeng Ren, University of Science and Technology of China, China
TPC Members
Chunhua Dong, University of Science and Technology of China, China
Feng Liu, Zhejiang University, China
Xiaogang Qiang, National Innovation Institute of Defense Technology, AMS, China
Xiaolong Su, Shanxi University, China
Qingyuan Zhao, Nanjing University, China
11. Multidimensional Optical Storage
Chairs
Qiming Zhang, Shanghai University of Technology, China
Xiao Lin, Fujian Normal University, China
Jijun Zhang, Hualu Group, China
TPC Members
Qidai Chen, Jilin University, China
Xiangping Li, Jinan University, China
Jianrong Qiu, Zhejiang University, China
Xiaodi Tan, Fujian Normal University, China
Changsheng Xie, Huazhong University of Science and Technology, China
Yong Zhang, Hualu Group, China
12. Optical Imaging and Display
Chairs
Jiangtao Xu, Tianjin University, China
Liangcai Cao, Tsinghua University, China
Lingling Huang, Beijing Institute of Technology, China
TPC Members
Kun Huang, University of Science and Technology of China, China
Tao Li, Nanjing University, China
Changju Liu, CETC Chongqing Acoustic-Optic-Electronic Co., Ltd., China
Liyuan Liu, Institute of Semiconductors, CAS, China
Xinzhu Sang, Beijing University of Posts and Telecommunications, China
Qionghua Wang, Beihang University, China
Lian Duan, Tsinghua University, China
Wen Qiao, Suzhou University, China
Qionghua Wang, Beihang University, China
Qun Yan, Fuzhou University, China
Zhenrong Zheng, Zhejiang University, China
13. Microwave Photonic Integration
Chairs
Shilong Pan, Nanjing University of Aeronautics and Astronautics, China
Tao Zhou, CETC 29, China
TPC Members
Tengfei Hao, Institute of Semiconductors, CAS, China
Pengfei Qu, CETC 44, China
Weifeng Zhang, Beijing Institute of Technology, China
Xin Zhong, CETC 29, China
Zixing Zhu, Air Force Engineering University, China
Xihua Zou, Southwest Jiaotong University, China
14. Lidar
Chairs
Li Zeng, Huawei, China
Minghua Chen, Tsinghua University, China
Jiaoqing Pan, Institute of Semiconductors, CAS, China
TPC Members
Yongqiang Ning, CIOMP, CAS, China
Chunhui Wang, Harbin Institute of Technology, China
Shaofeng Zhang, Hitronics Technologies, China
Li Zhao, Vertilite, China
Yiqiang Zhao, Tianjin University, China
Zhangming Zhu, Xidian University, China
15. Optical Sensing
Chairs
Tao Zhu, Chongqing University, China
Xiaopeng Dong, Xiamen University, China
TPC Members
Qun Hao, Beijing Institute of Technology, China
Fufei Pang, Shanghai University, China
Yidong Tan, Tsinghua University, China
Anbang Wang, Guangdong University of Technology, China
Xiaoji Zhou, Peking University, China
Invited talk
Plenary:
Rong Zhang, Xiamen University
Rong Zhang, Xiamen University
Xun Li, McMaster University——Recent advances on edge emitting semiconductor lasers
Wenyu Zhao, China Academy of Information and Communications Technology——Discussion on the development of high speed optoelectronic technology & industry in the era of computing power
Yichen Shen, Lightelligence Co., Ltd——Progress, opportunities and challenges of integrated photonics in large-scale computing
T1. Frontier Optoelectronic Devices and Integration
John P.R. David, The University of Sheffield——Antinomy based low noise Avalanche Photodiodes (Invited)
Liu Liu, Zhejiang University——Passive and active integrated photonic devices based on thin film lithium niobate (Invited)
Thomas Schneider, TU-Braunschweig——Integrated photonic assisted high-bandwidth signal processing with low-bandwidth electronics (Invited)
Xiankai Sun, The Chinese University of Hong Kong——Low-loss photonic integrated circuits based on overlay slot waveguides (Invited)
Chao Xiang, The University of Hong Kong——Heterogeneous laser integration in silicon photonics (Invited)
Xiulai Xu, Peking University (Invited)
Yongquan Zeng, Wuhan University——Topological photonic crystal lasers and its performance optimization (Invited)
Yong Zhang, Shanghai Jiao Tong University——High efficiency and large bandwidth topological electro-optic modulator (Invited)
T4. Optoelectronic Integrated Chip Packaging and Testing
T7. Electrical Chips for Optical Modules
T9. Smart Optical Computing
T2. Optoelectronic and Microelectronic Integrated Processing
Guoxin Cui, Nanjing Nanzhi Institute of Advanced Optoelectronics Integration Co., Ltd——A manufactory platform on lithium niobate on insulator (Invited)
Junqiu Liu, Shenzhen International Quantum Academy (Invited)
Siyang Liu, JFS Laboratory——Heterogeneous and hybrid integration platform for silicon photonics (Invited)
Cunzhu Tong, Jlight Semiconductor Technology Co., Ltd——Investigation on the 100Gb/s VCSELs (Invited)
Terence S.-Y. Chen, Latitude Design Automation——A flexible photonic integrated circuit simulator for time/frequency domain analysis, modulation bandwidth measurement, and integration of electrical-optical-electrical co-design and co-simulation (Invited)
Yan Yang, Institute of Microelectronics, Chinese Academy of Sciences——The silicon photonics integrated chip and process for trapped-ion quantum computing (Invited)
T3. Optoelectronic and Microelectronic Integrated Simulation and Design
Wenchao Chen, Zhejiang University——Multiphysics Computation for Semiconductor Devices and Heterogenous Integration (Invited)
Xiaoming Liu, Empyrean Technology Co., Ltd (Invited)
Nan Qi, Institute of Semiconductors, Chinese Academy of Sciences (Invited)
Min Tan, Huazhong University of Science and Technology——EDA platform compatible modeling and simulation for electronics-photonics convergence: challenges and progresses (Invited)
Jiang Xu, Hong Kong University of Science and Technology (Guangzhou) ——On Photonic-Electronic Design Automation (Invited)
Chenglin Xu, Synopsys Inc.——Inverse design automation for flat metalens built on photonic integrated platform (Invited)
Site Zhang, Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences——From electromagnetic solvers to ray tracing: Applying various computational methods in combination (Invited)
T4. Optoelectronic Integrated Chip Packaging and Testing
Yu Li, Shanghai Jiao Tong University——Advanced packaging in opto-electronic integration (Invited)
Zhiming Liu, Ceyear Technologies Co., Ltd——Research and development progress of localized testing instruments for optoelectronic integrated devices (Invited)
Yuechun Shi, Yongjiang Laboratory (Invited)
Xuerui Sun, EXFO Co., Ltd (Invited)
Haiyun Xue, Institute of Microelectronics, Chinese Academy of Sciences——2.5D and 3D advanced packaging for co-packaged optics (CPO) (Invited)
Chi Zhang, Huazhong University of Science and Technology——Ultra-large-bandwidth real-time data acquisition based on full-field spectrometer (Invited)
T5. Optical Transmission and Data Center Application
T5. Optical Transmission and Data Center Application
Yun Cao, Wuhan Fisilink Microelectronics Technology Co., Ltd——Development trends of high speed coherent integrated optical components (Invited)
Yang Liu, EPFL——Erbium-doped photonic integrated circuits (Invited)
Xuwei Xue, Beijing University of Posts and Telecommunications——The AWGR-based optical/electrical switching data center networks (Invited)
Ji Zhou, Jinan University——Digital signal processing for coherent passive optical networks
Jinyu Mo, POET Technologies——Hybrid-integration platform for next generation optical interconnects (Invited)
T6. Novel Chips for Optical Communication
Jianfeng Sun, Shanghai Satellite Network Research Institute Co., Ltd——Modularization and chiplization technology for space laser communication (Invited)
Jun Tan, Histarlink Technology Co., Ltd——the development and production of space laser communication terminals for satellite internet (Invited)
Binhao Wang, Xi'an Institute of Optics and Precision Mechanics, Chinese Academy of Sciences——Energy efficient silicon based wavelength division multiplexing optical interconnect chip (Invited)
Bing Xiong, Tsinghua University——Photodetectors with high saturation power and high speed performance (Invited)
Ke Xu, Harbin Institute of Technology, Shenzhen——Integrated silicon photonic components for optical communications at 2-mm waveband (Invited)
Xiaoguang Yang, Institute of Semiconductors, Chinese Academy of Sciences——Quantum dot lasers for high-density silicon photonic integrations (Invited)
Nan Ye, Shanghai University——The low-loss integrated spot size converter involving ion-implanted graded-index waveguide for alignment with cleaved single mode fiber (Invited)
Junping Zhang, Huawei Technologies Co., Ltd——Technical requirements for key components of integrated sensing and communication with optical wireless (Invited)
T7. Electrical Chips for Optical Modules
Tutorial: Dan Li, Xi'an Jiaotong University——Low-noise TIA design
Xuefeng Chen, PhotonIC Technologies (Shanghai) Co., Ltd——Development and commercialization of silicon electrical chips for high-speed optical link (Invited)
Haikun Jia, Tsinghua University——Silicon-based ultra-high-speed time-interleaved ADC design (Invited)
Ke Li, Peng Cheng Laboratory——High speed, low power data transmission using an integrated silicon photonics transmitter (Invited)
Vikas Manan, Chengdu InSiGa Semiconductor Technologies Co., Ltd——ICs for emerging markets- Linear Direct Drive and 50G PON (Invited)
Quan Pan, Southern University of Science and Technology——Research of high-speed low-power optical/wireline integrated circuits (Invited)
Ningfeng Tang, ZTE——The application and challenges of linear CPO (Invited)
T8. Nano Manufacturing and Equipment
Hui Su, Fujian Z.K. Litecore Co., Ltd——Progress On the commercialization of InP-based laser diodes and related optoelectronic devices (Invited)
Xianhe Liu, Xidian University Guangzhou Institute of Technology——High efficiency GaN-based nanowire LEDs—towards high efficiency ultrahigh density micro-displays (Invited)
Chao Peng, Peking University——Devices for topological photonic integration (Invited)
Zhifa Shan, Epihouse Optoelectronics Co., Ltd ——Progress of GaAs and InP based epitaxial materials (Invited)
Tony Xiang, Toptrans(Suzhou)Co., Ltd——Domestic manufacture of VCSEL: the roadmap and challenges (Invited)
Aydogan Ozcan, University of California, Los Angeles——Diffractive optical networks & computational imaging without a computer (Invited) (Online)
Hongwei Chen, Tsinghua University——Integrated diffractive optical neural network (Invited)
Zengguang Cheng, Fudan University——Photonic memories and computing based on phase-change materials (Invited)
Xiaoyong Hu, Peking University——Silicon-based optical computing devices (Invited)
Cheng Wang, ShanghaiTech University——Asynchronous, parallel, deep reservoir optical computing and its applications (Invited)
Xingyuan Xu, Beijing University of Posts and Telecommunications——Optical convolution accelerator based on microcombs (Invited)
T10. Optical Quantum Devices and Systems
Xiaolong Hu, Tianjin University——Superconducting nanowire single-photon detectors: Chips, systems and applications (Invited)
Xianmin Jin, Shanghai Jiao Tong University (Invited)
Xifeng Ren, University of Science and Technology of China——Quantum photonic sources based on nanostructures and nanomaterials (Invited)
Guangzong Xiao, National University of Defense Technology——Integrated levitated optomechanical inertial sensing system (Invited)
Qingyuan Zhao, Nanjing University——Hybrid integration of superconducting nanowire single photon detectors and readouts (Invited)
T13. Microwave Photonic Integration
T11. Multidimensional Optical Storage
Yaoyu Cao, Jinan University——Optical data storage in deep-subwavelength region (Invited)
Xiao Lin, Fujian Normal University——Advances in holographic data storage technology (Invited)
Hongjie Xiao, China Hualu Panasonic AVC Networks Co., Ltd——Optical storage market analysis and industrialization development (Invited)
Jie Yao, Huazhong University of Science and Technology——Research on high resolution scheme of writing pulses for recordable optical discs (Invited)
Kevin Zhang, Beijing KDS Datacenter Solution Technology Co., Ltd——Theoretical connotation/realistic challenges/ implementation paths of holographic optical storage (Invited)
T12. Optical Imaging and Display
Tutorial: Tao Li, Nanjing University——meta-imaging: From superlens to metalens
Shumei Chen, Harbin Institute of Technology, Shenzhen——Nonlinear chiroptical metasurface (Invited)
Zhangcheng Huang, Fudan University——Research on intelligent single-photon avalanche detector (Invited)
Guo Li, Huawei——Smartphone imaging - powering art through technology (Invited)
Liyuan Liu, Institute of Semiconductors, Chinese Academy of Sciences——Smart vision chip (Invited)
Wen Qiao, Soochow University——Future display enabled by planar optics (Invited)
Boxin Shi, Peking University——NeuCAP: Neuromorphic Camera Aided Photography (Invited)
Chao Zuo, Nanjing University of Science and Technology——High-speed 3D imaging and metrology: from classical fringe projection to deep learning approaches (Invited)
T13. Microwave Photonic Integration
Tutorial: Qifan Yang, Peking University——Integrated optical frequency comb
Hualong Bao, Soochow University——Low phase noise microwave generation based on optical frequency combs (Invited)
Hairun Guo, Shanghai University——optical metrology using frequency combs via photonic supercontinuum process (Invited)
Xingjun Wang, Peking University (Invited)
Xiaojun Xie, Southwest Jiaotong University——High-speed heterogeneous integrated photodiodes (Invited)
Zejie Yu, Zhejiang University——Integrated lithium niobate modulator (Invited)
Zhiyao Zhang , University of Electronic Science and Technology of China——Excitable spiking pulse generation in broadband optoelectronic oscillator (Invited)
Qiancheng Zhao, Southern University of Science and Technology——GaP-OI integrated nonlinear photonics (Invited)
T14. Lidar
Chao Chen, Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences——Semiconductor laser chips and narrow linewidth lasers for Lidar (Invited)
Weihua Guo, Huazhong University of Science and Technology——DBR laser diode used as the FMCW Lidar source (Invited)
Li Jin, Chongqing United Microelectronics Center——The research practice of solid-state Lidar optical phased array chip based on silicon photonics technology (Invited)
Hong Li, Neuvition——A progress review and future challenges on automotive long-range Lidar (Invited)
Rui Ma, Xidian University (Invited)
Wenjiang Shen, Suzhou Institute of Nano-tech and Nano-Bionics, Chinese Academy of Sciences——Study on temperature stability and vibration resistance of MEMS electromagnetic drive micromirrors (Invited)
Guanghua Yang, Inxun Technology Co., Ltd——Key technologies for silicon photonics solid-state FMCW Lidar (Invited)
Li Zhao, Vertilite——MJ VCSELs toward ultra high power and reliability for Lidar applications
(Invited)
T15. Optical Sensing
Zheyu Fang, Peking University——metal plasmon-two dimensional material optoelectronic devices (Invited)
Yuan Gong, University of Electronic Science and Technology of China——Optofluidic laser biochips for sensitive immunoassay (Invited)
Jun He, Shenzhen University——Femtosecond laser direct-written fiber bragg gratings: fabrication technologies and sensing applications (Invited)
Wei Wei, Chongqing University——Mid-infrared free-space optical modulator based on tunable surface plasmons (Invited)
Fei Xu, Nanjing University——All-fiber multifunction-integrated devices for sensing (Invited)
Yi Zou, ShanghaiTech University——Mid-infrared on-chip spectrometer (Invited)
Topics
1. Frontier Optoelectronic Devices and Integration
2. Optoelectronic and Microelectronic Integrated Processing
3. Optoelectronic and Microelectronic Integrated Simulation and Design
4. Optoelectronic Integrated Chip Packaging and Testing
5. Optical Transmission and Data Center Application
6. Novel Chips for Optical Communication
7. Electrical Chips for Optical Modules
8. Nano Manufacturing and Equipment
9. Smart Optical Computing
10. Optical Quantum Devices and Systems
11. Multidimensional Optical Storage
12. Optical Imaging and Display
13. Microwave Photonic Integration
14. Lidar
15. Optical Sensing
2. Optoelectronic and Microelectronic Integrated Processing
3. Optoelectronic and Microelectronic Integrated Simulation and Design
4. Optoelectronic Integrated Chip Packaging and Testing
5. Optical Transmission and Data Center Application
6. Novel Chips for Optical Communication
7. Electrical Chips for Optical Modules
8. Nano Manufacturing and Equipment
9. Smart Optical Computing
10. Optical Quantum Devices and Systems
11. Multidimensional Optical Storage
12. Optical Imaging and Display
13. Microwave Photonic Integration
14. Lidar
15. Optical Sensing
Submission
Please submit a 500-600 words abstract for technical review. If accepted, a 4-6 page manuscript can be submitted for publication in the conference proceedings (EI Indexed).
Abstract submission link: https://b2b.csoe.org.cn/submission/FPIC2023.html
Abstract Template for Oral/Poster Presentations:
Abstract Template for Oral and Poster.docx
Abstract Template for Invited Presentations:
Abstract Template for Invited Speakers.docx
Abstract submission link: https://b2b.csoe.org.cn/submission/FPIC2023.html
Abstract Template for Oral/Poster Presentations:
Abstract Template for Oral and Poster.docxAbstract Template for Invited Presentations:
Abstract Template for Invited Speakers.docx Publication
Program
Program at a Glance
Full Program
Please note that any changes will be subject to the final notification by the conference organizers on site.
Speaker Preparation
All presenters should check in at the corresponding session room at least 15 minutes prior to their scheduled talk to upload and check their presentation.
Poster Preparation
Authors should prepare their poster before the poster session starts. The poster must not exceed the boundaries of the display board. Authors are required to be standing by their poster for the duration of their allocated session to answer questions and further discuss their work with attendees.
Recommended Poster Size: 0.8m (Width) * 0.9m (Height)
Poster Template:
Poster Template--80cmx90cm.pptx
Set-up Time: 17:00–18:00, Day 1
Tear-down Time: 16:00–18:00, Day 3
|
8.12 |
8.13 |
8.14 |
8.15-17 |
|
| Registration | 10:00-20:00 | |||
| Panel | 13:30-18:00 | |||
| Opening Ceremony | 08:30-08:45 | |||
| Plenary Session | 08:45-12:00 | |||
|
Technical Sessions |
13:30-18:30 | 08:30-18:00 | ||
| Poster Session | 19:00-20:00 | |||
|
Exhibition &
Talent Recruitment |
08:30-18:00 | 08:30-18:00 |
||
| PIC Training | 08:30-17:00 |
Full Program
Please note that any changes will be subject to the final notification by the conference organizers on site.
Speaker Preparation
All presenters should check in at the corresponding session room at least 15 minutes prior to their scheduled talk to upload and check their presentation.
Poster Preparation
Authors should prepare their poster before the poster session starts. The poster must not exceed the boundaries of the display board. Authors are required to be standing by their poster for the duration of their allocated session to answer questions and further discuss their work with attendees.
Recommended Poster Size: 0.8m (Width) * 0.9m (Height)
Poster Template:
Poster Template--80cmx90cm.pptxSet-up Time: 17:00–18:00, Day 1
Tear-down Time: 16:00–18:00, Day 3
Registration
Registration Information
Registration for Chinese Attendees: https://b2b.csoe.org.cn/registration/FPIC2023.html
Registration for International Attendees: https://b2b.csoe.org.cn/registration/FPIC2023_en.html
Registration Fee
| Registration Type | On or Before 20 July 2023 | After 20 July 2023 |
| Regular Registration | CNY 3000 | CNY 3200 |
| Student Registration | CNY 2000 | CNY 2200 |
Registration Includes Day 1-3
* Admission to all technical sessions, plenaries, panels, tutorials and exhibition.* Lunches, dinners and coffee breaks during the conference.
* Conference program book, technical digest and conference bag.
* Publication fee, accommodation fee and training session is not included.
Payment
a. Pay online by bank transfer or Alipay.
b. Pay on-site by cash, credit card, or Alipay.
Sponsorship
Download
Activities
Ø Panel Discussion
Ø Tutorials
Ø PIC Training
Ø PIC Platform Exhibition
PIC materials and devices/simulation and design/process platforms/packaging and testing platforms, optical communication chips and materials/devices and modules/systems/ fiber optic cables, data centers, lidar, optical sensing and imaging, optical storage and display, micro/nano manufacturing platforms, test instruments, production system equipment, etc.
Ø Talent Recruitment
Space for recruitment advertisements will be set up during the meeting. Organizations with recruitment needs may contact the Committee to make an appointment. Both on-site presentation and recruitment table can be provided.
Ø Tutorials
Ø PIC Training
Organizers
SIMIT, Shandong University
Description
To deepen young researchers’ understanding of theoretical knowledge and engineering practice of PIC tape-out and software, and improve their professional skills, a two-day training will be held during the conference. Experienced experts will be invited to give lectures on fundamental concepts, practical operation and other skills.
There will be "Elementary class" and "Advanced class" for people with different foundations. The "Elementary class" focuses on the explanation of basic theories and a brief introduction of multiple platforms. The "Advanced class" focuses on the whole process of specific products design. In order to ensure the effectiveness of the training, the number of people in each class will be limited, and the Committee will decide on the final list based on the order of registration and the distribution of organizations.
Ø Special Session for International CooperationØ Young Entrepreneur Forum
Ø PIC Platform Exhibition
PIC materials and devices/simulation and design/process platforms/packaging and testing platforms, optical communication chips and materials/devices and modules/systems/ fiber optic cables, data centers, lidar, optical sensing and imaging, optical storage and display, micro/nano manufacturing platforms, test instruments, production system equipment, etc.
Ø Talent Recruitment
Space for recruitment advertisements will be set up during the meeting. Organizations with recruitment needs may contact the Committee to make an appointment. Both on-site presentation and recruitment table can be provided.
Hotel&Travel
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