Leading EMC and electromagnetic environmental effects technologies toward a new future and supporting the development of China’s strategic emerging industries and future‑oriented industries, the 2026 China Conference on EMC and Electromagnetic Environmental Effects Technology & Industrial Innovation will be held in Taiyuan from November 6 to 8, 2026.

This conference aims to build a forward‑looking, authoritative and high‑level industry exchange platform. It brings together top academicians home and abroad, distinguished experts from research institutions and industry leaders to discuss the latest technological breakthroughs ranging from fundamental theories to industrial applications, and align national major strategic needs with key bottlenecks in industrial development.

Top‑tier Think Tank, Insights into the Future The conference comprises a plenary forum and multiple thematic sub‑forums. Distinguished academicians and leading experts across the globe will be invited to share macro‑level trends and strategic perspectives, and identify the directions for technological advancement.

Comprehensive Coverage of Cutting‑edge Topics Discussions span a broad spectrum of frontier and hot‑spot areas. They cover emerging interdisciplinary subjects including low‑altitude economy, AI‑enabled technologies, quantum electromagnetics and bio‑electromagnetism. In‑depth attention will also be paid to electromagnetic safety and design challenges in key sectors such as intelligent connected vehicles, aerospace, future communications, national power systems and advanced rail transit. Cutting‑edge subjects including theoretical innovations in the post‑Kirchhoff era and EMC challenges for controlled nuclear fusion will also be addressed.

In‑depth Integration of Industry‑University‑Research‑Application The conference places strong emphasis on bridging technological achievements with industrial demands. It delivers targeted opportunities for exchange and collaboration among academia, research institutes, and upstream‑and‑downstream enterprises in the industrial chain, to jointly advance technological innovation and industrial upgrading.

Technology‑driven Industrial Empowerment In‑depth exchanges will be conducted on core enabling technologies such as electromagnetic spectrum sensing, high‑performance computing, multi‑physical‑field simulation and advanced electromagnetic materials, offering new ideas and solutions for practical engineering challenges. Closely aligned with Shanxi’s dual‑driven strategy of “energy plus manufacturing”, the conference will set a demonstration model for empowering the transformation and upgrading of traditional industrial bases via electromagnetic technologies.

We sincerely invite experts, scholars, engineers, entrepreneurs and practitioners at home and abroad engaged in the research, development, application and management of EMC, electromagnetic environmental effects and related technologies to attend this grand event. Let us gather for this intellectual feast, foster cooperative opportunities, and jointly draw a new blueprint for empowering thousands of industries with electromagnetic technologies.

Organizer: Chinese Society for Optical Engineering

Organizers-in-Charge: China Industrial Technology Innovation Strategic Alliance for Electromagnetic Environmental Effects The 33rd Research Institute of China Electronics Technology Group Corporation State Key Laboratory of Electromagnetic Compatibility and Protection China‑Belarus “Belt and Road” Joint Laboratory for Electromagnetic Environmental Effects

Co‑organizers: North University of China Shanxi University Taiyuan University of Technology State Key Laboratory of Electromagnetic Environmental Effects State Key Laboratory of Electromagnetic Effects and Safety for Marine Equipment State Key Laboratory of Electromagnetic Information Control and Effects State Key Laboratory of Intense Pulsed Radiation Simulation and Effects MIIT Key Laboratory of Electromagnetic Environmental Effects for Intelligent Systems and Equipment Key Laboratory of Electromagnetic Environmental Adaptability Measurement, Ministry of Education Shanxi Provincial Key Laboratory of Electromagnetic Intelligent Sensing‑Control and Advanced Electronic Integration Anhui Provincial Laboratory of Advanced Laser Technology Anhui Provincial Key Laboratory of Aircraft Electromagnetic Safety Aviation Science and Technology Key Laboratory of High‑Intensity Electromagnetic Environment Protection Technology Railway Industry Engineering Research Center for Electromagnetic Environmental Effects and Electromagnetic Safety Discipline and Technology Center for Extreme Electromagnetic Effect Evaluation and Protection China Mobile Group Design Institute Co., Ltd. Zhongguancun Sci‑Tech Intelligent Military Industry Technology Innovation Strategic Alliance National Advanced Aeronautical Equipment Technology Innovation Center Electromagnetic Environmental Effects Branch, Chinese Society of Aeronautics and Astronautics EMC Branch, China Institute of Communications Radiation Physics Branch, Chinese Nuclear Society

Honorary Chairs

GUO Guirong, Professor, National University of Defense Technology LIU Shanghe, Professor, Army Engineering University of PLA

General Chairs

SU Donglin, Professor, Beihang University LI Erping, Professor, Zhejiang University

Co‑Chairs

WANG Zhonglin, Professor, Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences CHEN Zhijie, Research Fellow, National Key Laboratory of Airspace Technology FEI Aiguo, Professor, Chinese Academy of Engineering HE You, Professor, Naval Aeronautical University OUYANG Xiaoping, Professor, Xiangtan University YANG Xiaoniu, Research Fellow, China Electronics Technology Group Corporation LU Jun, Research Fellow, China Electronics Technology Group Corporation SUN Cong, Research Fellow, China Aeronautical Research Institute YU Shaohua, Research Fellow, Pengcheng Laboratory WANG Qiuliang, Professor, Institute of Electrical Engineering, Chinese Academy of Sciences MAO Junfa, Professor, Shenzhen University LIU Yongjian, Research Fellow, Chinese Academy of Engineering YAO Fuqiang, Professor, National University of Defense Technology FAN Guobin, Research Fellow, China Academy of Engineering Physics ZHU Xuejun, Research Fellow, China Academy of Launch Vehicle Technology WU Jianqi, Research Fellow, China Electronics Technology Group Corporation LI Detian, Research Fellow, China Aerospace Science and Technology Corporation WANG Yanfei, Research Fellow, Aerospace Information Research Institute, Chinese Academy of Sciences ZHU Kun, Research Fellow, China Aerospace Science and Industry Corporation HU Jun, University of Electronic Science and Technology of China CHEN Qian, Professor, North University of China

Executive Chairs

DAI Fei, Beihang University CHEN Hongsheng, Zhejiang University MA Chen, The 33rd Research Institute of China Electronics Technology Group Corporation

Technical Program Committee (Sorted by Pinyin)

CHEN Liang, State Key Laboratory of Electromagnetic Effects and Safety for Marine Equipment CHEN Wei, State Key Laboratory of Intense Pulsed Radiation Simulation and Effects CHEN Yazhou, Army Engineering University of PLA CHU Qingxin, South China University of Technology DU Zhengwei, Tsinghua University FENG Quanyuan, Southwest Jiaotong University FENG Yijun, Nanjing University GAO Feng, China Mobile Group Design Institute Co., Ltd. GUO Chenjiang, Northwestern Polytechnical University HU Fei, Huazhong University of Science and Technology HU Haoquan, University of Electronic Science and Technology of China HU Yihua, National University of Defense Technology HUANG Zhixiang, Anhui University JIANG Dong, The 10th Research Institute of China Electronics Technology Group Corporation LI Long, Xidian University LI Zhibao, Hefei Hangtai Electro‑Physical Technology Co., Ltd. LIU Peiguo, National University of Defense Technology LIU Taijun, Ningbo University LIU Yuan’an, Beijing University of Posts and Telecommunications MA Kaixue, Tianjin University MENG Cui, Zhejiang University MENG Jin, Naval University of Engineering SHI Lihua, Army Engineering University of PLA SONG Zhaohui, Hangzhou Dianzi University SU Tao, Xidian University SUN Lingling, Hangzhou Dianzi University TANG Min, Shanghai Jiao Tong University WANG Dongjun, AVIC Chengdu Aircraft Industrial (Group) Co., Ltd. WANG Xuetian, Beijing Institute of Technology WEN Yinghong, Beijing Jiaotong University XIA Mingyao, Peking University XU Feng, Fudan University YANG Dong, The 33rd Research Institute of China Electronics Technology Group Corporation YIN Chengyou, National University of Defense Technology YIN Wenyan, Zhejiang University ZHAO Lidong, Beihang University ZHANG Anxue, Xi’an Jiaotong University ZHANG Weidong, North China Electric Power University ZHANG Xianmin, Ningbo Polytechnic ZHU Hongbo, Nanjing University of Posts and Telecommunications

Organizing Committee

WANG Yuexiang, The 33rd Research Institute of China Electronics Technology Group Corporation WANG Donghong, The 33rd Research Institute of China Electronics Technology Group Corporation BI Lidong, Chinese Society for Optical Engineering XU Hui, Beihang University

(I) Technical Sessions

Session 1: Low‑Altitude Economy LI Xinjun, Beihang University ZHANG Bin, No.704 Institute, the Ninth Academy of China Aerospace Science and Technology Corporation ZHENG Shengquan, State Key Laboratory of Electromagnetic Effects and Safety for Marine Equipment

Session 2: AI‑Empowered Electromagnetics Session Chairs: YI Da, Chongqing University MA Hanzhi, Zhejiang University

Session 3: Quantum Electromagnetics Session Chairs: REN Qun, Tianjin University LI Da, Zhejiang University

Session 4: Bio‑Electromagnetism Session Chairs: SONG Lingnan, Beihang University MA Hanzhi, Zhejiang University HU Liang, Beihang University

Session 5: The Post‑Kirchhoff Era Session Chairs: WU Qi, Beihang University CHEN Zhihong, Department 1, the First Academy of China Aerospace Science and Technology Corporation

Session 6: Electromagnetic Spectrum and Electromagnetic‑Environment Sensing & Utilization Session Chairs: MENG Jin, Naval University of Engineering LIU Taijun, Ningbo University GUO Lantu, China Research Institute of Radiowave Propagation LIN Yun, Harbin Engineering University

Session 7: Mechanisms and Countermeasure Technologies for Electromagnetic Emission, Susceptibility and Vulnerability Session Chairs: DAI Fei, Beihang University SHI Dan, Beijing University of Posts and Telecommunications CHEN Xiaoming, Xi’an Jiaotong University MENG Cui, Zhejiang University

Session 8: Advanced Electromagnetic Materials and Electromagnetic Protection Technologies Session Chairs: CHEN Yazhou, State Key Laboratory of Electromagnetic Environmental Effects, Army Engineering University of PLA WANG Donghong, The 33rd Research Institute of China Electronics Technology Group Corporation LIU Peiguo, National University of Defense Technology CHEN Chenlong, Fujian Institute of Research on the Structure of Matter, Chinese Academy of Sciences

Session 9: High‑Performance Electromagnetic Computation and Multi‑Physical‑Field Modeling & Simulation Session Chairs: REN Qiang, Beihang University GUO Lixin, Xidian University YANG Lixia, Anhui University CHEN Juan, Xi’an Jiaotong University

Session 10: Space Electromagnetic Environment and Satellite Internet Security Discussion Topics: ‑ EMC Design for Inter‑satellite Links ‑ Anti‑interference Capability Evaluation of Satellite Payloads ‑ Cooperative Spectrum Management for Ground Stations and Satellite Constellations ‑ Electromagnetic‑Environment Protection for Commercial Space Launch Sites

Session Chair: AN Jianping, Beijing Institute of Technology

(II) Industry Forums

Industry Forum 1: Electromagnetic Safety Technology and Application for National Power Facilities Session Chairs: ZHANG Jiangong, Director, Transmission Research Department, China Electric Power Research Institute LIU Lei, China Southern Power Grid Science Research Institute Co., Ltd. ZHAO Zhibin, Director, Advanced Power Transmission Research Institute, North China Electric Power University XIE Yanzhao, Director, Research Center of Electromagnetic Environment and Electromagnetic Safety, Xi’an Jiaotong University

Industry Forum 2: Cutting‑edge Electromagnetic‑Safety Technologies for Future Communication Systems Session Chairs: GAO Feng, General Manager & Professor‑level Senior Engineer, Network Optimization Product Department, China Mobile Group Design Institute Co., Ltd. LUO Guoqing, Director, Key Laboratory of Radio‑Frequency Circuits and Systems of Ministry of Education, Hangzhou Dianzi University LIU Leilei, Nanjing University of Posts and Telecommunications CHEN Qianbin, Chongqing University of Posts and Telecommunications WANG Weidong, Beijing University of Posts and Telecommunications

Industry Forum 3: Electromagnetic‑Safety Technology and Application for Intelligent Connected Vehicles Session Chairs: DING Yifu, China Automotive Technology & Research Center Co., Ltd. CHEN Guangzhi, Beihang University WANG Jian, Ningbo University

Industry Forum 4: Electromagnetic‑Safety Design and Exploration for Aeronautics, Astronautics and Ships Session Chairs: ZHANG Peng, Shenyang Aircraft Design & Research Institute, Aviation Industry Corporation of China WANG Dongjun, AVIC Chengdu Aircraft Industrial (Group) Co., Ltd. LI Yaoyao, Beihang University TAO Li, State Key Laboratory of Electromagnetic Effects and Safety for Marine Equipment

Industry Forum 5: Electromagnetic‑Safety Technology and Application for Advanced Rail Transit Systems Session Chairs: BAI Yingjie, Electromagnetic Research Division, CRSC Research & Design Institute Group Co., Ltd. LI Hong, School of Electrical Engineering, Zhejiang University GUAN Ke, Institute of Modern Communications, Beijing Jiaotong University

Industry Forum 6: Electromagnetic Safety and Environmental Adaptability of Devices & Chips Session Chairs: YAN Zhaowen, Beihang University WU Fan, Beijing University of Posts and Telecommunications HUANG Xiaozong, The 24th Research Institute of China Electronics Technology Group Corporation

 

 

 Submission Website: https://b2b.csoe.org.cn/submission/CEMEE2026.html

Submission Deadlines First‑round submission deadline: September 15, 2026 Both Chinese and English manuscripts are accepted. All submitted papers will undergo peer review organized by the conference committee. Accepted papers will be published mainly in the SPIE Proceedings (EI indexed). The typical peer‑review cycle is about 1‑2 weeks.

Authors submitting full papers for publication may be recommended by the conference committee to the following formal publications upon merit. Secondary submission to the target journal is required after authors receive the conference acceptance notification.

• SPIE Conference Proceedings (EI Indexed)
• EI Journals: Electromagnetic Science, Journal of Electronics and Information Technology, High Voltage Engineering
• SCI Journal: China Communications
• Chinese Core Journal: Chinese Journal of Radio Science
• Other Journals: Safety & EMC, Journal of Terahertz Science and Electronic Information Technology (Chinese Core Journal), Electric Power Information and Communication Technology

Acceptance notifications will be issued sequentially according to submission time and sent via email to the corresponding author’s mailbox.

English Manuscript Submission

For English papers: submit an English abstract (300‑500 words) via the conference website, and select “SPIE Proceedings” for the field “Primary Target Publication”. After abstract review approval, the full manuscript shall be submitted on the SPIE website. The SPIE full‑paper submission URL will be announced later. Approved English papers will be included in SPIE Proceedings (EI indexed).

Chinese Manuscript Submission

For Chinese papers: submit the full manuscript directly on the conference website and select “Journals” for the field “Primary Target Publication”. Qualified Chinese papers will be recommended to relevant journals for publication upon merit. Further notice will be given regarding page‑charge payment for Chinese submissions.

Presentation‑Only Submission (No Paper Publication)

If you only aim for poster or oral presentation without formal publication, upload your presentation abstract in the submission system and specify your presentation type (poster / oral presentation).

Conference Registration Fees:

Non-CSOE Members: Attendance fee 3263 RMB,

CSOE Members: Attendance fee 2863 RMB/person

Student Discount: 1863 RMB/person (excluding part-time/in-service students).

The conference fee includes conference bag, proceedings, program booklet, miscellaneous conference expenses, taxes, etc. It does not include publication charges or accommodation.

Publication Charge: 2500 RMB, with a maximum of two papers per first author.

Payment Methods:

Bank Transfer:

Account Name: Chinese Society for Optical Engineering

Bank: ICBC Beijing Science Park Sub-branch

Account Number: 0200296409200177730

Please ensure to note "OMTA + Participant Name" on the transfer for verification.

Registration Fee Refund:

Full refund is available up to 2 weeks (14 days) before the conference. Refunds will not be supported within 2 weeks of the conference due to incurred costs.

Conference Fee Invoice:

Invoices for the conference registration fee will be processed centrally two weeks before the conference and one week after the conference.

 BI Lidong, Chinese Society for Optical Engineering