地址:No.188 of Binhai Road, Jimo, Qingdao, China(点击查看地图)
场馆:Crowne Plaza Qingdao Ocean Spring Resort
Forum on Photonic Integrated Circuits 2022
2022-07-24~2022-07-2926703Qingdao
活动说明 
Forum on Photonic Integrated Circuits 2022- Summary
To further promote the technological exchange, industrial chain cooperation and talent training in photonic IC fields, the Chinese Society for Optical Engineering (CSOE), Shandong University and Hisense Broadband plan to hold "the 3rd Forum on Photonic Integrated Circuits", and invite over 200 top-class experts and scholars at home and abroad to discuss the latest progress of integrated photonics technologies and applications. There will also be interesting activities such as PIC training, panel discussions, tutorials, compact exhibtion, talent recruitment and best paper award to provide participants with frontier ideas and cutting-edge information, as well as professional development opportunities for enterprises, scientific researchers, teachers and students.
FPIC 2022 will be held in Qingdao, Shandong Province, on July 24-29, 2022. Welcome to this wonderful party!
Photo Download：
Baidu Pan link:https://pan.baidu.com/s/1tmXhWp0jOi5uWib-9LQrsQ
Password:44ol
For invoice and registration fee, please contact 022-58168510, zhangjie@csoe.org.cn
参会提示 参会须知-How to prepare to your attendence：
1. 对7天内有高风险区旅居史的人员，采取7天集中隔离医学观察；对7天内有中风险区旅居史的人员，采取7天居家隔离医学观察，如不具备居家隔离医学观察条件，采取集中隔离医学观察；
2. 7天内有中高风险区所在县（市、区、旗）的其他低风险区旅居史人员入鲁返鲁后，3天内开展2次核酸检测（间隔24小时），做好健康监测；
3. 对尚未公布中高风险区但7天内发生社会面疫情的地区，参照中风险区执行；
4. 请现场参会人员报到时提供48小时内的核酸检测阴性证明、健康码绿码和行程码截图，到会场后组委会将安排三天两检，会议期间须全程佩戴口罩；
5. 国内中高风险地区和国外人员请线上参会；
6. 为避免报到台拥挤，并尽早开具发票，请参会人员在7月20日前缴纳费用；
7. 协议酒店住宿预订截止日期为7月20日；
8. 盖章版会议通知和邀请函请在“下载文件”栏目下载。
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LiNbO3 crystals: from bulk to film Shining Zhu, Nanjing University, China |
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High-contrast metaoptics VCSEL Connie J. Chang-Hasnain, Berxel Photonics Corp., USA |
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Advanced photonic integration materials and technologies Siyuan Yu, Sun Yat-sen University, China |
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Progress of high-density integrated optical transceiver based on silicon photonics technology Takahiro Nakamura, AIO Core Co., Ltd., Japan |
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Commercial applications of high-index photonic circuits in China Brent Little, QXP Technologies Inc., China |
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Market and technology trends in silicon photonic based data communication Vivian Yang, Sicoya, Germany |
Host
Chinese Society for Optical Engineering (CSOE)
Organizers
FPIC Professional Committee of CSOE
Shandong University
Hisense Broadband Multimedia Technologies Co., Ltd.
Science and Technology on Electro-Optical Information Security Control Laboratory
Co-Organizers
China Information Communication Technologies Group Corporation
National Optoelectronics Innovation Center
Key Laboratory of Optoelectronic Technology & Systems (Chongqing University), Ministry of Education
Sponsors
Cooperative Media
组织机构Honorary Chairs
Qiming Wang, Institute of Semiconductors, CAS, China
Lianghui Chen, Institute of Semiconductors, CAS, China
General Chairs
Yueguang Lv, Chinese Academy of Engineering, China
Shaohua Yu, China Information Communication Technologies Group Co., China
General Co-Chairs
Jiangxing Wu, Chinese Academy of Engineering, China
Shining Zhu, Nanjing University, China
Min Gu, University of Shanghai for Science and Technology, China
Huilin Jiang, Changchun University of Science and Technology, China
Deren Yang, Zhejiang University, China
Xiangang Luo, Institute of Optics and Electronics, CAS, China
Fengyi Jiang, Nanchang University, China
Tiejun Cui, Southeast University, China
Ninghua Zhu, Institute of Semiconductors, CAS, China
Yi Luo, Tsinghua University, China
Executive Chairs
Weiping Huang, Hisense Broadband, China
Ming Li, Institute of Semiconductors, CAS, China
TPC Chairs
Xinliang Zhang, Huazhong University of Science and Technology, China
Jia Zhao, Shandong University, China
Hua Zhang, Hisense Broadband, China
TPC Co-Chairs
Zhangyuan Chen, Peking University, China
Song Guan, Science and Technology on Electro-Optical Information Security Control Laboratory
Yikai Su, Shanghai Jiao Tong University, China
Xi Xiao, National Optoelectronics Innovation Center, China
Kun Xu, Beijing University of Posts and Telecommunications, China
Chunlai Xue, Institute of Semiconductors, CAS, China
Jianyi Yang, Zhejiang University, China
Mingbin Yu, SIMIT, China
Li Zeng, Huawei, China
Xiaoping Zheng, Tsinghua University, China
Tao Zhu, Chongqing University, China
Sub-Conferences
1. Frontier Optoelectronic Devices and Integration
Chairs
Yikai Su, Shanghai Jiao Tong University, China
Daoxin Dai, Zhejiang University, China
Renmin Ma, Peking University, China
TPC Members
Xiaoyong Hu, Peking University, China
Jin Liu, Sun Yat-sen University, China
Xifeng Ren, University of Science and Technology of China, China
Jian Wang, Huazhong University of Science and Technology, China
Xiulai Xu, Peking University, China
2. Optoelectronic and Microelectronic Integrated Processing
Chairs
Mingbin Yu, SIMIT, CAS, China
Junbo Feng, Chongqing United Microelectronics Center, China
Baoshun Zhang, SINANO, CAS, China
TPC Members
Wei Jiang, Nanjing University, China
Zhihua Li, Institute of Microelectronics, CAS, China
Yu Liu, Institute of Semiconductors, CAS, China
Hui Su, Litecore, China
Yuanda Wu, Shijia Photons, China
Yong Zhang, Shanghai Jiao Tong University, China
3. Optoelectronic and Microelectronic Integrated Simulation and Design
Chairs
Jia Zhao, Shandong University, China
Xiaoming Liu, Empyrean, China
Zhigang Song, Institute of Semiconductors, CAS, China
TPC Members
Yan Cai, SIMIT, CAS, China
Wei Sha, Zhejiang University, China
Yu Wang, Institute of Microelectronics, CAS, China
Yejin Zhang, Institute of Semiconductors, CAS, China
4. Optoelectronic Integrated Chip Packaging and Testing
Chairs
Xi Xiao, National Optoelectronics Innovation Center, China
Jianwei Wang, InnoLight, China
Linjie Zhou, Shanghai Jiao Tong University, China
TPC Members
Yanfeng Fu, National Optoelectronics Innovation Center, China
Fengman Liu, Institute of Microelectronics, CAS, China
Yong Luo, Accelink Technologies, China
Liang Xie, Institute of Semiconductors, CAS, China
5. Optical Transmission and Data Center Application
Chairs
Hua Zhang, Hisense Broadband, China
Junjie Li, China Telecom, China
Huitao Wang, ZTE, China
TPC Members
Liangchuan Li, Huawei, China
Rui Lu, Alibaba, China
Shikui Shen, China Unicom, China
Min Sun, Tencent, China
Dong Wang, China Mobile, China
Xue Wang, New H3C Technologies, China
6. Visible Light Communication
Chairs
Nan Chi, Fudan University, China
Xiongbin Chen, Institute of Semiconductors, CAS, China
Lai Wang, Tsinghua University, China
TPC Members
Chen Gong, University of Science and Technology of China, China
Zhitong Huang, Beijing University of Posts and Telecommunications, China
Guoqiang Li, South China University of Technology, China
Jian Song, Tsinghua University, China
Guangxu Wang, Nanchang University, China
Tianhua Zhou, Shanghai Institute of Optics and Fine Mechanics, CAS, China
7. Space Laser Communication
Chairs
Wei Chen, Institute of Semiconductors, CAS, China
Qinggui Tan, Chinese Academy of Space Technology, China
Liang Zhang, Shanghai Institute of Technical Physics, CAS, China
TPC Members
Jizhao Lei, China Star Network System Research Institute Co., Ltd., China
Nannan Liu, Beijing Institute of Telemetry Technology, China
Wei Wang, Xi'an Institute of Optics and Precision Mechanics, CAS, China
Qingbo Yang, Harbin Institute of Technology, China
Siyuan Yu, Harbin Institute of Technology, China
Liang Zhang, Beijing Institute of Telemetry Technology, China
8. Smart Optical Computing
Chairs
Yichen Shen, Lightelligence, China
Xiaowen Dong, Huawei, China
Jingtao Fan, Tsinghua University, China
TPC Members
Hongwei Chen, Tsinghua University, China
Jianjun He, Zhejiang University, China
Jian Wu, Beijing University of Posts and Telecommunications, China
Fusheng Zhao, Institute of Microelectronics, CAS, China
9. Optical Quantum Devices and Systems
Chairs
Jianwei Wang, Peking University, China
Xianmin Jin, Shanghai Jiao Tong University, China
Xiaolong Su, Shanxi University, China
TPC Members
Zhenghua An, Fudan University, China
Xifeng Ren, University of Science and Technology of China, China
Ping Xu, National University of Defense Technology, China
Lin Yang, Beijing Institute of Computer Technology and Application, China
Yan Yang, Institute of Microelectronics, CAS, China
10. Multidimensional Optical Storage
Chairs
Qiming Zhang, Shanghai University of Technology, China
Xiangping Li, Jinan University, China
Jijun Zhang, Hualu Group, China
TPC Members
Qidai Chen, Jilin University, China
Hao Ruan, Shanghai Institute of Optics and Fine Mechanics, CAS, China
Xiaodi Tan, Fujian Normal University, China
Changsheng Xie, Huazhong University of Science and Technology, China
11. Optical Display
Chairs
Xinzhu Sang, Beijing University of Posts and Telecommunications, China
Lingling Huang, Beijing Institute of Technology, China
Ling Li, Institute of Microelectronics, CAS, China
TPC Members
Lian Duan, Tsinghua University, China
Wen Qiao, Suzhou University, China
Qionghua Wang, Beihang University, China
Qun Yan, Fuzhou University, China
Zhenrong Zheng, Zhejiang University, China
12. Optical Imaging
Chairs
Jiangtao Xu, Tianjin University, China
Liangcai Cao, Tsinghua University, China
TPC Members
Huiyong Hu, Xidian University, China
Changju Liu, CETC Chongqing Acoustic-Optic-Electronic Co., Ltd., China
Qiongge Sun, China Aerospace Science and Industry Co., Ltd., China
Xingjun Wang, Peking University, China
Nanjian, Wu Institute of Semiconductors, CAS, China
13. Microwave Photonic Integration
Chairs
Shilong Pan, Nanjing University of Aeronautics and Astronautics, China
Tao Zhou, CETC 29, China
Wangzhe Li, Aerospace Information Research Institute, CAS, China
TPC Members
Xiangfei Chen, Nanjing University, China
Zhangyuan Chen, Peking University, China
Yi Dong, Beijing Institute of Technology, China
Zhibiao Hao, Tsinghua University, China
Lijun Sun, CETC 44, China
Yuncai Wang, Guangdong University of Technology, China
14. Lidar
Chairs
Li Zeng, Huawei, China
Jiaoqing Pan, Institute of Semiconductors, CAS, China
Minghua Chen, Tsinghua University, China
TPC Members
Yongqiang Ning, Changchun Institute of Optics, Fine Mechanics and Physics, CAS, China
Chunhui Wang, Harbin Institute of Technology, China
Shaofeng Zhang, Hitronics Technologies, China
Li Zhao, Vertilite, China
Yiqiang Zhao, Tianjin University, China
Zhangming Zhu, Xidian University, China
15. Optical Sensing
Chairs
Chenyang Xue, North University of China, China
Tao Zhu, Chongqing University, China
TPC Members
Qun Hao, Beijing Institute of Technology, China
Anbang Wang, Taiyuan University of Technology, China
Huimin Zhang, Xiamen University, China
Jing Zhang, Tsinghua University, China
Yongsen Yu, Jilin University, China
Xiaoji Zhou, Peking University, China
Qiming Wang, Institute of Semiconductors, CAS, China
Lianghui Chen, Institute of Semiconductors, CAS, China
General Chairs
Yueguang Lv, Chinese Academy of Engineering, China
Shaohua Yu, China Information Communication Technologies Group Co., China
General Co-Chairs
Jiangxing Wu, Chinese Academy of Engineering, China
Shining Zhu, Nanjing University, China
Min Gu, University of Shanghai for Science and Technology, China
Huilin Jiang, Changchun University of Science and Technology, China
Deren Yang, Zhejiang University, China
Xiangang Luo, Institute of Optics and Electronics, CAS, China
Fengyi Jiang, Nanchang University, China
Tiejun Cui, Southeast University, China
Ninghua Zhu, Institute of Semiconductors, CAS, China
Yi Luo, Tsinghua University, China
Executive Chairs
Weiping Huang, Hisense Broadband, China
Ming Li, Institute of Semiconductors, CAS, China
TPC Chairs
Xinliang Zhang, Huazhong University of Science and Technology, China
Jia Zhao, Shandong University, China
Hua Zhang, Hisense Broadband, China
TPC Co-Chairs
Zhangyuan Chen, Peking University, China
Song Guan, Science and Technology on Electro-Optical Information Security Control Laboratory
Yikai Su, Shanghai Jiao Tong University, China
Xi Xiao, National Optoelectronics Innovation Center, China
Kun Xu, Beijing University of Posts and Telecommunications, China
Chunlai Xue, Institute of Semiconductors, CAS, China
Jianyi Yang, Zhejiang University, China
Mingbin Yu, SIMIT, China
Li Zeng, Huawei, China
Xiaoping Zheng, Tsinghua University, China
Tao Zhu, Chongqing University, China
Sub-Conferences
1. Frontier Optoelectronic Devices and Integration
Chairs
Yikai Su, Shanghai Jiao Tong University, China
Daoxin Dai, Zhejiang University, China
Renmin Ma, Peking University, China
TPC Members
Xiaoyong Hu, Peking University, China
Jin Liu, Sun Yat-sen University, China
Xifeng Ren, University of Science and Technology of China, China
Jian Wang, Huazhong University of Science and Technology, China
Xiulai Xu, Peking University, China
2. Optoelectronic and Microelectronic Integrated Processing
Chairs
Mingbin Yu, SIMIT, CAS, China
Junbo Feng, Chongqing United Microelectronics Center, China
Baoshun Zhang, SINANO, CAS, China
TPC Members
Wei Jiang, Nanjing University, China
Zhihua Li, Institute of Microelectronics, CAS, China
Yu Liu, Institute of Semiconductors, CAS, China
Hui Su, Litecore, China
Yuanda Wu, Shijia Photons, China
Yong Zhang, Shanghai Jiao Tong University, China
3. Optoelectronic and Microelectronic Integrated Simulation and Design
Chairs
Jia Zhao, Shandong University, China
Xiaoming Liu, Empyrean, China
Zhigang Song, Institute of Semiconductors, CAS, China
TPC Members
Yan Cai, SIMIT, CAS, China
Wei Sha, Zhejiang University, China
Yu Wang, Institute of Microelectronics, CAS, China
Yejin Zhang, Institute of Semiconductors, CAS, China
4. Optoelectronic Integrated Chip Packaging and Testing
Chairs
Xi Xiao, National Optoelectronics Innovation Center, China
Jianwei Wang, InnoLight, China
Linjie Zhou, Shanghai Jiao Tong University, China
TPC Members
Yanfeng Fu, National Optoelectronics Innovation Center, China
Fengman Liu, Institute of Microelectronics, CAS, China
Yong Luo, Accelink Technologies, China
Liang Xie, Institute of Semiconductors, CAS, China
5. Optical Transmission and Data Center Application
Chairs
Hua Zhang, Hisense Broadband, China
Junjie Li, China Telecom, China
Huitao Wang, ZTE, China
TPC Members
Liangchuan Li, Huawei, China
Rui Lu, Alibaba, China
Shikui Shen, China Unicom, China
Min Sun, Tencent, China
Dong Wang, China Mobile, China
Xue Wang, New H3C Technologies, China
6. Visible Light Communication
Chairs
Nan Chi, Fudan University, China
Xiongbin Chen, Institute of Semiconductors, CAS, China
Lai Wang, Tsinghua University, China
TPC Members
Chen Gong, University of Science and Technology of China, China
Zhitong Huang, Beijing University of Posts and Telecommunications, China
Guoqiang Li, South China University of Technology, China
Jian Song, Tsinghua University, China
Guangxu Wang, Nanchang University, China
Tianhua Zhou, Shanghai Institute of Optics and Fine Mechanics, CAS, China
7. Space Laser Communication
Chairs
Wei Chen, Institute of Semiconductors, CAS, China
Qinggui Tan, Chinese Academy of Space Technology, China
Liang Zhang, Shanghai Institute of Technical Physics, CAS, China
TPC Members
Jizhao Lei, China Star Network System Research Institute Co., Ltd., China
Nannan Liu, Beijing Institute of Telemetry Technology, China
Wei Wang, Xi'an Institute of Optics and Precision Mechanics, CAS, China
Qingbo Yang, Harbin Institute of Technology, China
Siyuan Yu, Harbin Institute of Technology, China
Liang Zhang, Beijing Institute of Telemetry Technology, China
8. Smart Optical Computing
Chairs
Yichen Shen, Lightelligence, China
Xiaowen Dong, Huawei, China
Jingtao Fan, Tsinghua University, China
TPC Members
Hongwei Chen, Tsinghua University, China
Jianjun He, Zhejiang University, China
Jian Wu, Beijing University of Posts and Telecommunications, China
Fusheng Zhao, Institute of Microelectronics, CAS, China
9. Optical Quantum Devices and Systems
Chairs
Jianwei Wang, Peking University, China
Xianmin Jin, Shanghai Jiao Tong University, China
Xiaolong Su, Shanxi University, China
TPC Members
Zhenghua An, Fudan University, China
Xifeng Ren, University of Science and Technology of China, China
Ping Xu, National University of Defense Technology, China
Lin Yang, Beijing Institute of Computer Technology and Application, China
Yan Yang, Institute of Microelectronics, CAS, China
10. Multidimensional Optical Storage
Chairs
Qiming Zhang, Shanghai University of Technology, China
Xiangping Li, Jinan University, China
Jijun Zhang, Hualu Group, China
TPC Members
Qidai Chen, Jilin University, China
Hao Ruan, Shanghai Institute of Optics and Fine Mechanics, CAS, China
Xiaodi Tan, Fujian Normal University, China
Changsheng Xie, Huazhong University of Science and Technology, China
11. Optical Display
Chairs
Xinzhu Sang, Beijing University of Posts and Telecommunications, China
Lingling Huang, Beijing Institute of Technology, China
Ling Li, Institute of Microelectronics, CAS, China
TPC Members
Lian Duan, Tsinghua University, China
Wen Qiao, Suzhou University, China
Qionghua Wang, Beihang University, China
Qun Yan, Fuzhou University, China
Zhenrong Zheng, Zhejiang University, China
12. Optical Imaging
Chairs
Jiangtao Xu, Tianjin University, China
Liangcai Cao, Tsinghua University, China
TPC Members
Huiyong Hu, Xidian University, China
Changju Liu, CETC Chongqing Acoustic-Optic-Electronic Co., Ltd., China
Qiongge Sun, China Aerospace Science and Industry Co., Ltd., China
Xingjun Wang, Peking University, China
Nanjian, Wu Institute of Semiconductors, CAS, China
13. Microwave Photonic Integration
Chairs
Shilong Pan, Nanjing University of Aeronautics and Astronautics, China
Tao Zhou, CETC 29, China
Wangzhe Li, Aerospace Information Research Institute, CAS, China
TPC Members
Xiangfei Chen, Nanjing University, China
Zhangyuan Chen, Peking University, China
Yi Dong, Beijing Institute of Technology, China
Zhibiao Hao, Tsinghua University, China
Lijun Sun, CETC 44, China
Yuncai Wang, Guangdong University of Technology, China
14. Lidar
Chairs
Li Zeng, Huawei, China
Jiaoqing Pan, Institute of Semiconductors, CAS, China
Minghua Chen, Tsinghua University, China
TPC Members
Yongqiang Ning, Changchun Institute of Optics, Fine Mechanics and Physics, CAS, China
Chunhui Wang, Harbin Institute of Technology, China
Shaofeng Zhang, Hitronics Technologies, China
Li Zhao, Vertilite, China
Yiqiang Zhao, Tianjin University, China
Zhangming Zhu, Xidian University, China
15. Optical Sensing
Chairs
Chenyang Xue, North University of China, China
Tao Zhu, Chongqing University, China
TPC Members
Qun Hao, Beijing Institute of Technology, China
Anbang Wang, Taiyuan University of Technology, China
Huimin Zhang, Xiamen University, China
Jing Zhang, Tsinghua University, China
Yongsen Yu, Jilin University, China
Xiaoji Zhou, Peking University, China
专家报告Track 1. Frontier Optoelectronic Devices and Integration
metamaterial enabled on-chip light manipulation——Xuhan Guo, Shanghai Jiao Tong University, China
Global Mie Theory——Wei Liu, National University of Defense Technology, China
Optical phased array based on silicon waveguide for wide-angle beam steering——Yaocheng Shi, Zhejiang University, China
Integrated photonics on Lithium-Niobate on insulator——Jinsong Xia, Huazhong University of Science and Technology, China
Research on ultra-sensitive and high-specific photosensor chip towards next generation health detection ——Han Zhang, Shenzhen University, China
Memristive light emitting nanoantenna——Shunping Zhang, Wuhan University, China
Xulin Zhang, Jilin University, China
Non-Hermitian photonics: new functionality by symmetry, new opportunity beyond symmetry——Zhifeng Zhang, University of Pennsylvania, USA
Track 2. Optoelectronic and Microelectronic Integrated Processing
Single-crystal lithium niobate thin films for integrated photonics——Hui Hu, Shandong University, China
Commercialization path and ecological construction of silicon photonics technology——Miaofeng Li, Alibaba Group, China
The Status of Si-photonics industrialization and progress in AMF as foundry——Patrick Lo, AMF, Singapore
InP photonic integrated device and platform——Dan Lu, Institute of Semiconductors, CAS, China
Heterogenous integration of chalcogenide photonic devices on silicon——Wei Shi, Laval University, Canada
Research and platform construction of PLC photonic integration technology——Xiaojie Yin, Henan Shijia Photons, China
Introduction of domestic silicon photonic integration technology and platforms——Mingbin Yu, SIMIT, CAS, China
TBD——Yunsong Zhao, Hisense Broadband, China
Track 3. Optoelectronic and Microelectronic Integrated Simulation and Design
An electronic-photonic design automation (EPDA) platform that enables the scalable silicon photonic circuit design, verification, and implementation——Terence S.-Y. Chen, Latitude Design Automation, China
Multiscale modeling of rdiation effects of silicon-based devices——Yonggang Li, Institute of Solid State Physics, HFIPS, CAS, China
Atomistic simulations of nanoscale optoelectronic devices——ChiYung Yam, University of Electronic Science and Technology of China, China
Large-scale nano-optics dimulation — fast solver and preconditioner——Wei Sha, Zhejiang University, China
Compact photonic device modeling and electronic-photonic co-simulation——Min Tan, Huazhong University of Science and Technology, China
The application of high-performance computing in the design of solar cell devices——Ruimeng Wang, The University of New South Wales, Australia
The challenges of photonic design automation in the cloud-computing era——Hongchao Zhou, Shandong University, China
Track 4. Optoelectronic Integrated Chip Packaging and Testing
Optoelectronic vector analyzing technology based on microwave phtonics and its applications——Jianbin Fu, Newkey Photonics Technologies Co., Ltd., China
Analysis on the demand of optoelectronic testing instruments in optical communication industry and their localization status——Zhiming Liu, Ceyear Technologies Co., Ltd., China
Progress in high-density optical and elctrical package for silicon photonics——Liangjun Lu, Shanghai Jiao Tong University, China
The technologies and challenges of silicon photonics modules testing, assembling and coupling——Xu Sun, Crealights Technology Co.Ltd., China
TBD——Dong Wang, National Information Optoelectronic Innovation Center, China
Optoelectronic integration package and connectivity solutions——Tiejun Zhang, Suzhou TFC Optical Communication Co., Ltd, China
Track 5. Optical Transmission and Data Center Application
What's next for pluggables in data centers?——Frank Chang, Source Photonics, USA
New Trend of Open and Disaggregated Optical Networks——Sai Chen, Alibaba Group, China
F5G technology trends of campus optical access networks——Liangchuan Li, Huawei, China
Evolution direction and trend analysis of 5G optical modules——Huitian Liu, ZTE, China
Efficient station type design in optical transmission systems——Jianing Lu, Tencent, China
The discussion of ultra-high-speed optical transport network development and key technologies——Dong Wang, Research Institute of China Mobile, China
Chanllages and developments of high speed optical connections——Xue Wang, H3C Technologies Co., Ltd., China
Discussion of ultra-long haul optical transmission and its requirements of core devices——Lipeng Feng, China Telecom Research Institute, China
The road to convergence of optical and IP networks——Di Zhang, Kuaishou Technologies, China
Track 6. Visible Light Communication
GaN-based materials and laser diodes——Degang Zhao, Institute of Semiconductors, CAS, China
Photonic neural networks for optical communications——Chaoran Huang, The Chinese University of Hong Kong, China
Research progress of GaN single crystal growth and communication application——Zongliang Liu, Jiangsu Institute of Advanced Semiconductors Ltd., China
Communication, sensing and powering tecnology based on visible light transmission——Huimin Lu, University of Science and Technology Beijing, China
Long-wave infrared FSO enabled by directly modulated quantum cascade laser and passive quantum cascade detector——Xiaodan Pang, KTH Royal Institute of Technology, Sweden
III-Nitride photonic integration for visible light communications——Chao Shen, Fudan University, China
High efficient AlGaN-based ultraviolet light emitting and detecting devices——Haiding Sun, University of Science and Technology of China, China
Recent research progress in GaN-based micro-LED for visible light communication——Liancheng Wang, Central South University, China
Semiconductor based ultraviolet light emitting and infrared detection devices——Feng Wu, Huazhong University of Science and Technology, China
Visible light sensing communication in hybrid network architectures——Zichen Xu, Nanchang University, China
Track 7. Space Laser Communication
TBD——Jiacheng Meng, Xi'an Institute of Optics and Precision Mechanics, CAS, China
Development and experiment of stratospheric laser communication payload——Jinbiao Liu, CETC 34, China
Small size and low cost laser communication terminal technology——Jianfeng Sun, Shanghai Institute of Optics and fine Mechanics, CAS, China
Development and prospect of deep space laser communication technology——Changzhi Xu, Academy of Space Information Systems, China
Research on key technologies in high speed optical communication systems——Junjie Zhang, Shanghai University, China
Wireless UV technology to guide UAV flight——Taifei Zhao, Xi'an University of Technology, China
Track 8. Smart Optical Computing
Real-time training of photonic neural network chip——Jianji Dong, Huazhong University of Science and Technology, China
On-demand photonic ising machine based on discrete coherent spatial modes——Xue Feng, Tsinghua University, China
The research on timing-dependent photonics-enabled neural network——Nuannuan Shi, Institute of Semiconductors, CAS, China
Possible architecture for photonic computation——Jian Wu, Beijing University of Posts and Telecommunications, China
Photonic intelligent hardware for tensor convolution operation——Wenjia Zhang, Shanghai Jiao Tong University, China
Process error analysis methods and tools for integrated optical systems——Fusheng Zhao, Institute of Microelectronics, CAS, China
Track 9. Optical Quantum Devices and Systems
Quantum transducer based on optomechanical chip——Guangwei Deng, University of Electronic Science and Technology of China, China
Low-loss silicon photonics platform for quantum photonic applications——Yunhong Ding, Technical University of Denmark, Denmark
Recent progress in photonic crystal ring and its applications——Xiyuan Lu, University of Maryland, USA
Practical quantum key distribution powered by compact size silicon and III-V optoelectronic devices——Yi Qian, China Information and Communication Technologies Group Corporation, China
Advances in programmable silicon photonic circuits for quantum computation——Xiaogang Qiang, National Innovation Institute of Defense Technology, AMS, China
Single-photon imaging and sensing——Feihu Xu, University of Science and Technology of China, China
Topological dynamics and sensing with exceptional points——Haitan Xu, Southern University of Science and Technology, China
High performance silicon photonic integrated devices for quantum applications——Ming Zhang, Zhejiang University, China
Photonic chip for quantum distribution networks——Wei Zhang, Tsinghua University, China
Track 10. Multidimensional Optical Storage
Multi-dimensional multiplexed optical storage by orbital angular momentum beams——Xiangping Li, Jinan University, China
Applications of deep learning in holographic storage——Xiao Lin, Fujian Normal University, China
Scalable DNA-based digital data storage using a microchip——Hong Liu, Southeast University, China
Research on dynamic reading technology of high-speed multilayer fluorescent ——Jianshe Ma, Tsinghua Shenzhen International Graduate School, China
Photonic glass: regulation of micro-nano structures and applications in optical storage——Dezhi Tan, Zhejiang Lab, China
Recent progress of nanophotonic optical data storage——Qiming Zhang, University of Shanghai for Science and Technology, China
Research and detection of optical disc focusing spot——Yong Zhang, China Hualu Group Co.,Ltd., China
Track 11. Optical Display
TBD——Yong Bi, Technical Institute of Physics and Chemistry, CAS, China
Micro/nanofabrication and printing fabrication technologies for optical display applications——Zheng Cui, Suzhou Institute of Nanoteh, CAS, China
Innovation of free 3D display and development of medical applications——Hong'en Liao, Tsinghua University, China
Quantum dot displays——Xiaowei Sun, Southern University of Science and Technology, China
In situ fabricated perovskite quantum dots for display technology——Haizheng Zhong, Beijing Institute of Technology, China
Harnessing plenoptic function for 3D display——Jianying Zhou, Sun Yat-sen University, China
Track 12. Optical Imaging
High dynamic image sensor technology——Yuchun Chang, Dalian University of Technology, China
Differential lens design and its application in imaging——Ni Chen, KAUST, Saudi Arabia
Low noise and high sensitivity photoelectric imaging device——Jing Gao, Tianjin University, China
CMOS single photon image sensor ——Liyuan Liu, Institute of Semiconductors, CAS, China
Multiple dimensional optical single-pixel imaging——Baoqing Sun, Shandong University, China
Structured illumination for computational imaging——Mingjie Sun, Beihang University, China
Readout circuits for quanta image sensors——Zhaoyang Yin, Dartmouth College, USA
Low-light night vision camera and low-light image enhancement technology——Hangying Zhang, Tsinghua University, China
Study on the key issues of high-spectral resolution information sensing——Yu Zhang, Hangzhou Dianzi University, China
Resonant metasurfaces and novel micro-nano optical devices——Guoxing Zheng, Wuhan University, China
Track 13. Microwave Photonic Integration
High-speed thin-film lithium niobate devices——Xinlun Cai, Sun Yat-sen University, China
Transmission of laser for microwave photonic link application——Tianshu Wang, Changchun University of Science and Technology, China
Low power Si photonics chip and system application——Xingjun Wang, Peking University, China
Silicon photonic integration and microwave photonics——Hui Yu, Zhejiang University, China
Si-Ge photodetector and its applications——Yu Yu, Huazhong University of Science and Technology, China
2D high speed optoelectronic conversion array——Mingshan Zhao, Dalian University of Technology, China
Lithium niobate-on-insulator devices for nonlinear photonics: Fabrication and applications——Yuanlin Zheng, Shanghai Jiao Tong University, China
Track 14. Lidar
Hybrid integrated FMCW laser with ultra narrow linewidth for LiDAR system——Minghua Chen, Tsinghua University, China
Development progress of short-wave infrared APD focal plane arrays——Dajian Cui, CETC 44, China
SPAD d-ToF for real sensing——Cheng Li, visionICs Microelectronics Technology, China
InP/InGaAs SPAD with low dark count rate——Yanli Shi, Yunnan University, China
On-chip silicon photonic FMCW LiDAR——Guan Wang, LightIC, China
High-power,high integrated VCSEL for next-generation Lidar——Jiaxing Wang, Shenzhen Berxel Photonics Co., Ltd., China
Silicon nitride waveguide devices and process integration——Yan Yang, Institute of Microelectronics, CAS, China
Research of microstructured laser array with controllable beams——Yejin Zhang, Institute of Semiconductors, CAS, China
Integrated receiver ASIC and system for LiDAR——Yiqiang Zhao, Tianjin University, China
Track 15. Optical Sensing
Study on performance improvement of coherent optical time domain reflectometer——Baoquan Jin, Taiyuan University of Technology, China
Phase noise dynamics in soliton microcombs——Fuchuan Lei, Chalmers University of Technology, Sweden
On-chip spectrometer based on lithium niobate modulator——Gaoyuan Li, ETH Zurich, Switzerland
Nanocrystal silicon based fluorescence sensing for pH detection and bio-imaging——Yufei Liu, Chongqing University, China
MEMS optical sensors integrated with nanostructures——Haiyang Mao, Institute of Microelectronics, CAS, China
Levitated optomechanical systems and its inertial sensing application——Dingbang Xiao, National Univerisity of Defense Technology, China
Femtosecond laser helical scanning and parallel point-by-point fabrication of sapphire fiber grating high temperature sensor——Yongsong Yu, Jilin University, China
In situ sensor and testing technology based on optical micro/nano structure for extreme environments——Yongqiu Zheng, North University of China, China
议题方向
1. Frontier Optoelectronic Devices and Integration
2. Optoelectronic and Microelectronic Integrated Processing
3. Optoelectronic and Microelectronic Integrated Simulation and Design
4. Optoelectronic Integrated Chip Packaging and Testing
5. Optical Transmission and Data Center Application
6. Visible Light Communication
7. Space Laser Communication
8. Smart Optical Computing
9. Optical Quantum Devices and Systems
10. Multidimensional Optical Storage
11. Optical Display
12. Optical Imaging
13. Microwave Photonic Integration
14. Lidar
15. Optical Sensing
2. Optoelectronic and Microelectronic Integrated Processing
3. Optoelectronic and Microelectronic Integrated Simulation and Design
4. Optoelectronic Integrated Chip Packaging and Testing
5. Optical Transmission and Data Center Application
6. Visible Light Communication
7. Space Laser Communication
8. Smart Optical Computing
9. Optical Quantum Devices and Systems
10. Multidimensional Optical Storage
11. Optical Display
12. Optical Imaging
13. Microwave Photonic Integration
14. Lidar
15. Optical Sensing
投稿指南Please submit a 500-600 words abstract for technical review. If accepted, a 4-6 page manuscript can be submitted for publication in the conference proceedings (EI Indexed).
Abstract submission link: https://b2b.csoe.org.cn/submission/FPIC2022.html
Abstract Template for Oral/Poster Presentations:
Abstract Template for Oral and Poster.docx
Abstract Template for Invited Presentations:
Abstract Template for Invited Speakers.docx
Awards
Best Student Paper Award/ 5 winners
Any full-time university student, who is the first author as well as the presenter of a paper submitted with choosing presentation type of “Oral”will be eligible for this award. Oral presentation applications will be reviewed and evaluated by the Committee. If accepted, the contact author will receive notification of acceptance by email. Certificates will be presented to the winners at the conference.
Best Poster Award/ 5 winners
Any poster paper that is registered by at least one of the authors, presented during the assigned time slot will be eligible for this award. Certificates will be presented to the winners at the conference. 论文出版
会议日程
Program at a Glance
Full Program
FPIC 2022 Conference Program 0721
Please note that any changes will be subject to the final notification by the conference organizers onsite.
Speaker Preparation
All presenters should check in at the corresponding session room at least 30 minutes prior to their scheduled talk to upload and check their presentation.
Poster Preparation
Authors should prepare their poster before the poster session starts. The poster must not exceed the boundaries of the display board. Authors are required to be standing by their poster for the duration of their allocated session to answer questions and further discuss their work with attendees.
Recommended Poster Size: 0.8m (Width) * 0.9m (Height)
Poster Template:
Poster Template--80cmx90cm.pptx
Set-up Time: 17:00–18:00, Day 1
Tear-down Time: 16:00–18:00, Day 3
|
7.24 |
7.25 |
7.26 |
7.27-29 |
|
| Registration | 10:00-20:00 | |||
| Panels & Tutorials | 15:00-18:00 | |||
| Opening Ceremony | 08:30-08:45 | |||
| Plenary Session | 08:45-12:00 | |||
|
1. Frontier Optoelectronic Devices and Integration |
13:30-18:00 | |||
| 2. Optoelectronic and Microelectronic Integrated Processing 7. Space Laser Communication 8. Smart Optical Computing 11. Optical Display 13. Microwave Photonic Integration |
08:30-18:00 | |||
| 4. Optoelectronic Integrated Chip Packaging and Testing 6. Visible Light Communication 9. Optical Quantum Devices and Systems 12. Optical Imaging 15. Optical Sensing |
13:30-18:00 | |||
|
Best Paper Award |
18:00-18:20 | |||
| Poster Session | 13:00-13:30 | 13:00-13:30 | ||
|
Exhibition & Talent Recruitment
|
08:30-18:30 | 08:30-18:30 |
||
| Training | 08:00-18:00 |
Full Program
FPIC 2022 Conference Program 0721Please note that any changes will be subject to the final notification by the conference organizers onsite.
Speaker Preparation
All presenters should check in at the corresponding session room at least 30 minutes prior to their scheduled talk to upload and check their presentation.
Poster Preparation
Authors should prepare their poster before the poster session starts. The poster must not exceed the boundaries of the display board. Authors are required to be standing by their poster for the duration of their allocated session to answer questions and further discuss their work with attendees.
Recommended Poster Size: 0.8m (Width) * 0.9m (Height)
Poster Template:
Poster Template--80cmx90cm.pptxSet-up Time: 17:00–18:00, Day 1
Tear-down Time: 16:00–18:00, Day 3
会议注册
Registration Information (Mainland China)
Registration link: https://b2b.csoe.org.cn/registration/FPIC2022.html
Registration Fee
| Registration Type | On or Before 15 July 2022 | After 15 July 2022 |
| Regular Registration | RMB 2600 | RMB 3000 |
| Student Registration | RMB 2000 | RMB 2200 |
Registration Includes Day 1-3
* Admission to all technical sessions, plenaries, panels, tutorials and exhibition.* Lunches, dinners and coffee breaks during the conference.
* Conference program book, technical digest and conference bag.
* Publication fee and training session is not included.
Payment
a. Pay online by bank transfer or Alipay.
b. Pay on-site by cash, credit card, or Alipay.
会议费包括:
1、第1-3日所有会场和展区入场；
2、第2-3日午餐，第1-3日晚餐，会议期间茶歇；
3、会议手册、会议投稿光盘、资料袋。
培训报名网址：https://b2b.csoe.org.cn/registration/FPIC2022_Training.html
培训费：初级班1500元/人，高阶班3000元/人。
初级班培训费包括第4日的:
1、培训课程入场；
2、午餐；
3、电子版和纸质版资料。
高阶班培训费包括第4-6日的:
1、培训课程入场；
2、午餐；
3、电子版和纸质版资料。
每班限额：初级班70人，高阶班40人
缴费方式：
a) 银行汇款：
电汇账户：中国光学工程学会
账号：0200296409200177730
开户行：工行北京科技园支行
附言备注项：FPIC+参会人姓名
b)在线支付：注册完成后，可跳转到在线支付页面，选择“支付宝”在线完成支付。
注意事项（非常重要）：
1、如果您计划先垫付再报销，请先跟单位财务沟通好是否支持这种方式。
2、会议费不包含论文出版费和住宿费。
3、若要享受提前注册优惠，请于截止日期之前完成支付。
4、由于会议预算有限，邀请报告人也需要注册并缴纳会议费。
5、竞选优秀论文奖的代表，需本人为第一作者，付费注册并亲自进行报告。
6、请有意向参加培训的代表先报名，在收到组委会的遴选结果通知后再缴费，缴费后非不可抗力原因不予退还。
Registration Information (Outside of Mainland China)
Registration link: https://b2b.csoe.org.cn/registration/FPIC2022_en.html
Registration Deadline: 20 July 2022
Registration Fee
| Registration Type | Registration Fee |
| Regular Registration | USD 260 |
| Student Registration | USD 180 |
Registration Includes
* Admission to online plenaries and sub-conferences.* Electronic version of conference program book and technical digest.
* Publication fee and other technical sessions are not included.
会员申请
企业赞助
Various kinds of sponsor opportunities for compact exhibition and the conference are open now. Please contact us for more information.
下载文件
同期活动
Ø Panels
1. Large Scale Integrated Chip: Photonic-Electronic Convergence
Organizers
Xi Xiao, National Optoelectronics Innovation Center, China
Yikai Su, Shanghai Jiao Tong University, China
Description
Optoelectronic and microelectronic fusion technology is one of the future development trends of optoelectronic integration, which is expected to significantly reduce the size, power consumption and cost of chips. This panel will discuss the specific implementation, processes, performance analysis and potential applications of monolithic photonic integrated chips and other related technologies in response to the challenges in the future.
Speakers
Mingche Lai, National University of Defense Technology, China
112GBaud all silicon transmitter——Ke Li, University of Southampton, UK
Information photonic-electronic convergence: Concepts and challenges——Min Tan, Huazhong University of Science and Technology, China
2. Future Trend of Optical Storage with Logic-in-Memory and Neuromorphic Computing
Organizers
Qiming Zhang, Shanghai University of Technology, China
Xiangping Li, Jinan University, China
Jijun Zhang, Hualu Group, China
Description
In the era of Big Data, how to store massive amounts of data in a safe, long-term, and low-cost way has become an important issue. In the past 10 years, AI technology represented by deep learning has profoundly affected human society, but “real intelligence” is still on its way by learning from the human brain’s integration of storage and computing. The technical prospects are promising. This panel will conduct cutting-edge discussions on topics such as phase change memory, deep learning, neuromorphic computing, optical artificial intelligence accelerator, multi-dimensional optical storage, and super-resolution optical storage from the two perspectives of integrating storage and computing.
Speakers
Application of silicon photonics on intelligence computing: opportunity and challenges——Shanshan Yu, Lightelligence, China
Oxide-based neuromorphic devices for brain-like computing——Qing Wan, Nanjing University, China
Femtosecond laser direct writing for eternal data storage: fast & furious——Lei Wang, Jilin University, China
Phase-change memory — from electronic data storage to optical computing——Ming Xu, Huazhong University of Science and Technology, China
Eternal optical data storage based on nanostructuring in glass——Jingyu Zhang, Huazhong University of Science and Technology, China
Ø Tutorials
1. Optical Computing Chips
Yichen Shen, Lightelligence, China
Bing Bai, Photoncounts, China
2. Key Technologies of Lidar
Linjie Zhou, Shanghai Jiao Tong Univeristy, China
3. Silicon Photonic Coupling Technology, Principle, Progress and Application
Hongyan Fu, Tsinghua Shenzhen International Graduate School, China
4. From F5G to F6G
Zhicheng Ye, Huawei, China
Ø PIC Tape-out and Software Training (on site)
Organizers
Shandong University, SIMIT, Hisense Broadband
Description
To deepen young researchers’ understanding of theoretical knowledge and engineering practice of PIC tapeout and software, and improve their professional skills, a two-day training will be held during the conference. Experienced experts will be invited to give lectures on fundamental concepts, practical operation and other skills.
There will be "Elementary class" and "Advanced class" for people with different foundations. The "Elementary class" focuses on the explanation of basic theories and a brief introduction of multiple platforms. The "Advanced class" focuses on the whole process of specific products design. In order to ensure the effectiveness of the training, the number of people in each class will be limited, and the Committee will decide on the final list based on the order of registration and the distribution of organizations.
Official Website: https://b2b.csoe.org.cn/meeting/FPIC2022_Training.html
Ø Compact Exhibition
PIC materials and devices/simulation and design/process platforms/packaging and testing platforms, optical communication chips and materials/devices and modules/systems/ fiber optic cables, data centers, lidar, optical sensing and imaging, optical storage and display, micro/nano manufacturing platforms, test instruments, production system equipment, etc.
Ø Talent Recruitment
Space for recruitment advertisements will be set up during the meeting. Organizations with recruitment needs may contact the Committee to make an appointment. Both on-site presentation and recruitment table can be provided.
1. Large Scale Integrated Chip: Photonic-Electronic Convergence
Organizers
Xi Xiao, National Optoelectronics Innovation Center, China
Yikai Su, Shanghai Jiao Tong University, China
Description
Optoelectronic and microelectronic fusion technology is one of the future development trends of optoelectronic integration, which is expected to significantly reduce the size, power consumption and cost of chips. This panel will discuss the specific implementation, processes, performance analysis and potential applications of monolithic photonic integrated chips and other related technologies in response to the challenges in the future.
Speakers
Mingche Lai, National University of Defense Technology, China
112GBaud all silicon transmitter——Ke Li, University of Southampton, UK
Information photonic-electronic convergence: Concepts and challenges——Min Tan, Huazhong University of Science and Technology, China
2. Future Trend of Optical Storage with Logic-in-Memory and Neuromorphic Computing
Organizers
Qiming Zhang, Shanghai University of Technology, China
Xiangping Li, Jinan University, China
Jijun Zhang, Hualu Group, China
Description
In the era of Big Data, how to store massive amounts of data in a safe, long-term, and low-cost way has become an important issue. In the past 10 years, AI technology represented by deep learning has profoundly affected human society, but “real intelligence” is still on its way by learning from the human brain’s integration of storage and computing. The technical prospects are promising. This panel will conduct cutting-edge discussions on topics such as phase change memory, deep learning, neuromorphic computing, optical artificial intelligence accelerator, multi-dimensional optical storage, and super-resolution optical storage from the two perspectives of integrating storage and computing.
Speakers
Application of silicon photonics on intelligence computing: opportunity and challenges——Shanshan Yu, Lightelligence, China
Oxide-based neuromorphic devices for brain-like computing——Qing Wan, Nanjing University, China
Femtosecond laser direct writing for eternal data storage: fast & furious——Lei Wang, Jilin University, China
Phase-change memory — from electronic data storage to optical computing——Ming Xu, Huazhong University of Science and Technology, China
Eternal optical data storage based on nanostructuring in glass——Jingyu Zhang, Huazhong University of Science and Technology, China
Ø Tutorials
1. Optical Computing Chips
Yichen Shen, Lightelligence, China
Bing Bai, Photoncounts, China
2. Key Technologies of Lidar
Linjie Zhou, Shanghai Jiao Tong Univeristy, China
3. Silicon Photonic Coupling Technology, Principle, Progress and Application
Hongyan Fu, Tsinghua Shenzhen International Graduate School, China
4. From F5G to F6G
Zhicheng Ye, Huawei, China
Ø PIC Tape-out and Software Training (on site)
Organizers
Shandong University, SIMIT, Hisense Broadband
Description
To deepen young researchers’ understanding of theoretical knowledge and engineering practice of PIC tapeout and software, and improve their professional skills, a two-day training will be held during the conference. Experienced experts will be invited to give lectures on fundamental concepts, practical operation and other skills.
There will be "Elementary class" and "Advanced class" for people with different foundations. The "Elementary class" focuses on the explanation of basic theories and a brief introduction of multiple platforms. The "Advanced class" focuses on the whole process of specific products design. In order to ensure the effectiveness of the training, the number of people in each class will be limited, and the Committee will decide on the final list based on the order of registration and the distribution of organizations.
Official Website: https://b2b.csoe.org.cn/meeting/FPIC2022_Training.html
Ø Compact Exhibition
PIC materials and devices/simulation and design/process platforms/packaging and testing platforms, optical communication chips and materials/devices and modules/systems/ fiber optic cables, data centers, lidar, optical sensing and imaging, optical storage and display, micro/nano manufacturing platforms, test instruments, production system equipment, etc.
Ø Talent Recruitment
Space for recruitment advertisements will be set up during the meeting. Organizations with recruitment needs may contact the Committee to make an appointment. Both on-site presentation and recruitment table can be provided.
Workshop 交通住宿
Venue（会场）
Crowne Plaza Qingdao Ocean Spring Resort, No.188 of Binhai Road, Jimo, Qingdao China (https://www.ihg.com.cn/crowneplaza/hotels/gb/en/qingdao/taojc/hoteldetail)
青岛海泉湾皇冠假日度假酒店，山东省青岛市即墨区滨海公路188号
Hotel（会议合作酒店）
Crowne Plaza Qingdao Ocean Spring Resort（青岛海泉湾皇冠假日度假酒店）
Room Price:
Standard Twin Room 450 RMB per day (with 1 breakfast), 480 RMB per day (with 2 breakfast);
Room Reservation: Please Contact Ms. Ma, 15086871@qq.com.
价格：园景大床房/双床房单早450元/间•天，双早480元/间•天。由于各房型数量有限，组委会将按照预订顺序安排。
酒店住房已满！如果没有收到酒店的确认电话，则请尝试预订其他酒店。
Transportation（交通）
From Qingdao Jiaodong International Airport（青岛胶东国际机场）
By Metro: 2 hour 20 min
By Taxi: 1 hour 10 min, 80 km
From Jimobei Railway Station（即墨北站）
By Bus: 1 hour 40 min
By Taxi: 50 min, 30 km
From Qingdaobei Railway Station（青岛火车站北站）
By Metro: 1 hour 40 min
By Taxi: 1 hour, 54 km
往届回顾
联系方式
Sub-Conferences, Submission, Registration
ZHANG Shu, 022-58168542, zhangshu@csoe.org.cn
Panels, Tutorials, Media, Sponsors
ZHANG Jie, 022-58168510, zhangjie@csoe.org.cn
Training
ZHANG Boru, 13911650484, zbr413@163.com
Talent Recruitment
GUO Sheng, 18710157604, guosheng@csoe.org.cn
Exhibition
GUO Sheng, 18710157604, guosheng@csoe.org.cn
ZHAN Jiahe, 1562051653, zhanjiahe@csoe.org.cn
WANG Can, 13810630623, wangcan@csoe.org.cn
Local Organizer
HE Shuhui, hsh@sdu.edu.cn
YAN Xueyi, xueyi_yan@126.com
ZHAO Ting, 202112671@mail.sdu.edu.cn
LIU Yanan, 915838973@qq.com
YANG Xiyu yxy19980110@163.com
WANG Yiming 202112667@mail.sdu.edu.cn
ZHANG Shu, 022-58168542, zhangshu@csoe.org.cn
Panels, Tutorials, Media, Sponsors
ZHANG Jie, 022-58168510, zhangjie@csoe.org.cn
Training
ZHANG Boru, 13911650484, zbr413@163.com
Talent Recruitment
GUO Sheng, 18710157604, guosheng@csoe.org.cn
Exhibition
GUO Sheng, 18710157604, guosheng@csoe.org.cn
ZHAN Jiahe, 1562051653, zhanjiahe@csoe.org.cn
WANG Can, 13810630623, wangcan@csoe.org.cn
Local Organizer
HE Shuhui, hsh@sdu.edu.cn
YAN Xueyi, xueyi_yan@126.com
ZHAO Ting, 202112671@mail.sdu.edu.cn
LIU Yanan, 915838973@qq.com
YANG Xiyu yxy19980110@163.com
WANG Yiming 202112667@mail.sdu.edu.cn