Computational Imaging& Achievements Exhibition & Presentation Session

       The "6th International Conference on Computational Imaging", will be held in Shenzhen from September 11th to 13th, 2026. t is hoped that through the communication between the two parties, the integrated development of fields such as imaging  will be promoted. It will focus on the development progress of computational imaging  technology, as well as the urgent challenges currently faced. Taking this opportunity, the "Exhibition of Computational Imaging Achievements" will be held concurrently, aiming to comprehensively review and showcase the academic achievements of computational imaging  technology, as well as the development of theories, technologies, and products related to the industrial chain. It is hoped that through this event, the weak links in its ecosystem will be revealed, providing strong support for the future development direction, and better promoting the development of computational imaging and technology themselves, as well as its applications in multiple fields.

     This achievement exhibition will be divided into categories of "Advanced Devices, Innovative Algorithms, System Design, and Application Products" according to the entire industrial chain of computational imaging. The achievements from September 2025 to August 2026 will be show cased. This achievement exhibition mainly targets teams with independent research and development capabilities. According to the applying units, it will be collected through two channels: "academic" and "industrial". Universities, scientific research institutions can submit achievement information through the "academic channel", and enterprises can submit achievement information through the "industrial channel". Each team can submit no more than two achievements.

     Teams interested in participating are requested to scan the QR code or click the link to fill in the application form for the "Exhibition of Computational Imaging Achievements" and then submit it.

(Please scan the QR code to download the relevant documents.)

    Deadline: 30th June

Registration Website（English）：https://b2b.csoe.org.cn/submission/CITA2026_en.html
1.Conference Fee

Student conference fee(CSOE Member)：1802yuan
General conference fee(CSOE Member)：2802yuan

Student conference fee：1802yuan（Early Bird before 11th August)&2002yuan

General conference fee：3402yuan（Early Bird before 11th August)&3602yuan 

2.Become  member(加入学会会员 享受会议优惠价）
https://b2b.csoe.org.cn/member/invite.php?user=baiyu&goto=account

点击链接，扫描二维码填写信息，完成支付，成为会员，并自动生成会员证书。

3.Payment Type（Please note your name and unit when you pay）：
1）Remittance transfer
Name & Address：CHINESE SOCIETY FOR OPTICAL ENGINEERING（中国光学工程学会）/NO.1 BLDG HAIYING ROAD FENGTAI DISTRICT BEIJING CHINA
Number：0200296409200177730
Account Opening Bank：Industrial and Commercial Bank of China Limited Beijing Science and Technology Park Sub-branch（中国工商银行股份有限公司北京科技园支行）
Bank Number：102100029646
Corporate Organization Code：71784043-7
SWIFT CODE:ICBKCNBJBJM
 2）Online Payment
After registration, you can jump to the online payment page, choose "Alipay" to complete the payment online

4.Conference Registration Fee Refund
The registration fee can be refunded in full 2 weeks (14 days) before the meeting, and refunds will no longer be supported for meeting costs incurred over 2 weeks

5.Conference Registration Fee Invoice
After successful registration and payment, log in to the registration website again to apply for an invoice and issue it independently.（自助申请开票）

Attention:
1.The payment before 18th August will enjoy the preferential price,and the original price will be restored after that
2.Please complete rhe refund before 5th September 
3.CSOE membership benefits are for members of the Chinese Society for Optical Engineering whose membership cards are valid

The Proceedings of this conference will bepublished in the SPIE Digital Library withover 450,000 papers from other outstanding conferences and SPIE Journals and books from SPIE Press.

Supported Journals

PhotoniX (SCI)

Infrared and Laser Engineering (EI)

PhotoniX Life
PhotoniX Synergy

Opto-Electronic Advances( SCI)

Photonic Sensors(SCI)

Journal of Infrared and Millimeter Waves (SCI)

Optical Precision Engineering (EI)

Acta Photonica Sinica (EI)

Journal of Semiconductors (EI)

Chinese Optics(EI)

   海报模板：  CITA-Poster-Template-80cmx80cm .pptx
（制作好后请自行带到会场进行粘贴，制作时请制作带有“背胶”）

·Physical Modeling and Information Theory of Imaging Systems

·Optical Transfer Function Theory

·Optical Information Theory and Signal Processing

·Inverse Problem Solving and Optimization Algorithms

·System Performance Evaluation Methods and Standards

·Computational Imaging and Deep Learning Theory

Topic 2: Non-Line-of-Sight and Scattering Imaging

· Complex Medium Light Transmission Control Technologies

· Imaging through Scattering Media

· Non-Line-of-Sight (NLOS) Imaging and Looking Around the Corner

· Adaptive Optics and Wavefront Shaping
· Time-Reversal Imaging

Flagship Topic 3 :
1) 3D imaging and measurement 

·Structured light 3D imaging

·Fringe/speckle projection profilometry

·Photogrammetry

·Photometric stereo vision

·Time of Flight (ToF) imaging

·LiDAR 

·Digital Image Correlation (DIC)

·Shape from Defocus

·Phase Measurement Deflectometry

·Rapid 3D imaging technology

·Integrated imaging

·Light Field 3D Imaging

·Deep Learning-based 3D imaging technology

·3D Imaging and Sensing Technology with Computational Imaging in Interdisciplinary Fields

2)3D vision

·3D sensing

·Stereoscopic vison

·3D modeling

·3D visual perception and edge computing

·3D data semantic segmentation and understanding

·3D data processing, storing and transmission

·Hardware, algorithm, and techniques relating to 3D vision

3) 3D display

·Digital holography

·Naked eye 3D display

·Integrated light field display

·Volumetric 3D display

·Virtual reality/augmented reality/mixed reality 

·Hardware, algorithm, and techniques relating to 3D display

Topic 4: Polarization Imaging and Event Imaging

· Polarization Parameter Measurement and Calibration

· Polarization-Gated Imaging

· Polarization 3D Imaging

· Polarization Biological Microscopy

· Polarization Target Detection and Recognition

· Polarization Dehazing/Underwater Imaging

· Neuromorphic Imaging and Sensing

· Event-Driven Computational Imaging

Topic 5: Holography and Phase Imaging

· Holographic Interferometric Measurement

· Digital Holography Technology

· Holographic Microscopy

· Quantitative Phase Imaging

· Coherent Diffraction Imaging

· Lensless Imaging

· Iterative Phase Recovery

· Light Intensity Transfer Equation

· Layered Imaging

· Fourier Layered Imaging

· Tomographic 3D Measurement

· Optical Diffraction Tomography

· Coherence Measurement

Topic 6: Multiband and Spectral Imaging

· Infrared/Low-Light-Level Computational Imaging

· Visible/Infrared Image Multimodal Fusion

· Terahertz Computational Imaging

· Microwave/X-ray Computational Imaging

· Aperture Coding Imaging

· Wavefront Coding Imaging

· Synthetic Aperture Imaging

· Computational Multi/High/Hyper-Spectral Imaging Technologies

· Advanced Spectrometer Design

· Spectral Data Processing and Analysis

Topic 7: Single-Photon/Single-Pixel/Quantum Imaging

· Single-Photon Detection Technology

· Fundamental Theory of Correlated Imaging

· Computational Correlated Imaging

· Single-Pixel Imaging

· Quantum Correlated Imaging

· Quantum Tomography Techniques

· Quantum-Enhanced Sensing

Topic 8: Micro/Nano-Optics Computational Imaging

· Multidimensional Light Field Control Based on Micro/Nano-Optics

· Diffraction Optics and Computational Imaging

· Metasurfaces and Metaphotonics

· Computational Imaging Based on Artificial Nano/Micro Structures

· Liquid Lenses and Computational Imaging

· Planar Optical Element Design

· Photoelectronic Integrated Imaging Chips

Topic 9: Biomedical Optical Imaging

· Super-Resolution Microscopy

· Deep-Penetration Microscopy

· Label-Free Microscopy

· Large-Field High-Resolution Mesoscopic Imaging

· Ultrasound/Photoacoustic/Thermal/X-ray Imaging

· Optical Manipulation and Optical Tweezers

· Optical Coherence Tomography

· Optical Tomography

· Magnetic Resonance Imaging

· Wearable/Interventional Imaging

· Cross-Blood-Brain-Barrier Neuroimaging

· Single-Molecule Localization and Dynamic Tracking· Intelligent Surgical Navigation Imaging

Topic 10 (Special Topic): Artificial Intelligence and Computational Imaging

· Artificial Intelligence and Deep Learning Technologies

· Deep Learning-Based Imaging System Design

· Deep Learning-Based Computational Imaging Reconstruction

· Physics-Driven Deep Learning

· Optical Neural Networks

· Optical Computing and Photonic Chips

· Intelligent Imaging Electronics and Detectors

· Big Data/Big Models Supporting Computational Imaging

· Intelligent Detectors and Processors

Topic 11 (Special Topic): Extreme Challenges in Computational Imaging

· Ultrafast Computational Optical Imaging

· Ultraspeed Transient Imaging and Testing

· Microscale Computational Imaging

· Passive Super-Resolution Imaging Detection

· Turbid Underwater Imaging Compensation

· Strong Scattering Media Imaging

· Long-Distance Target Imaging and Detection

· Large-Scale Target Imaging and Measurement

· Imaging in Strong Scattering Media

· Multiphysical Field Fusion Imaging

· Multisystem/Multiple Array Collaborative Imaging

· Multisource Platform Data Processing and Fusion

· Computational Imaging-Communication Joint Optimization

· Distributed/Edge Intelligent Imaging Systems

Chinese Society for Optical Engineering (CSOE)

Organizers：

Computational Imaging Committee, CSOE
Tsinghua Shenzhen International Graduate School

National Key Laboratory of Electromagnetic Space Security
PhotoniX/PhotoniX Life/PhotoniX Synergy

Co-Organizers：

Tsinghua University

Xi'an Institute of Optics and Precision Mechanics of CAS
Shenzhen University
Southern University of Science and Technology
Nanjing University of Science Technology

The Chinese University of Hong Kong

Smart Computational Imaging Research Institute of Nanjing University of Science and Technology

International Steering Committee：

David Brady, University of Arizona, USA

Sylvain Gigan, Sorbonne University, France

Ayodogan Ozcan, University of California,Los Angeles, USA

Guoan Zheng, University of Connecticut, USA
 

Honorary Chair：

Songlin Zhuang, University of Shanghai for Science and Technology

General Chairs:

Min Gu, University of Shanghai for Science and Technology

Jianyu Wang, Shanghai Institute of Technical Physics, Chinese Academy of Sciences

David Brady, University of Arizona, USA

Co-Chairs：

Qian Chen, North University of China
Huijie Zhao, Beihang University
Liangcai Cao, Tsinghua University

Xiaopeng Shao, Xi'an Institute of Optics and Precision Mechanics of CAS

Xiaodi Tan, Fujian Normal University
Dapeng Wang, National Key Laboratory of Electromagnetic Space Security

Xueqian Wang, Tsinghua Shenzhen International Graduate School

Executive Chairs:
Qian Zhou, Tsinghua Shenzhen International Graduate School

Chao Zuo, Nanjing University of Science Technology

Program Committee

Chairs:

Xun Cao, Nanjing University

Kemao Qian, Nanyang Technological University

Xin Yuan, Westlake University
Xiaoli Liu, Shenzhen University
Tongyu Liu, National Key Laboratory of Electromagnetic Space Security
Kai Ni, Tsinghua Shenzhen International Graduate School

Organizing Committee

Chairs:
Fei Liu, Xi Dian University, China

Bo Dai, University of Shanghai for Science and Technology
Ping Su, Tsinghua Shenzhen International Graduate School

Shijie Feng, Nanjing University of Science Technology

Members：
Puxiang Lai, The Chinese University of Hong Kong
Xin JIn, Tsinghua Shenzhen International Graduate School
Han Zhang, Shenzhen University

     Relevant enterprises in the industry are invited to gather for exhibition and communication. The invitation scope includes chips (GPU, FPGA, ASIC), basic hardware (light sources, lenses, industrial 3D cameras, image acquisition cards, DLP devices, lasers, image processing units, visual processing software), cloud computing, data centers, industry solutions, etc.

      Head of the Exhibition Department (Enterprise Participation in Exhibitions, Sponsorship)

 
        Contact：

      Rongpeng E, China

      Tel: 13001030561

      Sheng Guo, China

Special Sessions for Young Scholars and Master and Doctoral Students

     In order to further strengthen the construction of the young talent team, stimulate the scientific research enthusiasm of young scholars, and support and encourage the growth of young scholars at all levels, this conference is jointly organized by various topics. Special sessions for young scholars' reports will be held during the conference, and participation certificates will be issued. Excellent reports will be selected and awarded certificates. The specific holding time and arrangements of the special sessions will be notified separately. Young scholars are warmly welcome to actively submit contributions and sign up to participate.

 一、Young Scholars
1.Participation Method: Submit an extended abstract in the conference submission system.  When submitting, select "Young Scholars " in the topic options. Submission  website:https://b2b.csoe.org.cn/submission/CITA2026_cn.html

2. Eligibility Requirements: Young scholars under 35 years old 
3. Report Time: 8 minutes.
4. Review Experts: Experts from each topic; Professional committee members of the special committee.


二、Master and Doctoral Students
1. Participation Method: Choose either to participate in the special session for "Master and Doctoral Students ".
2. Eligibility Requirements: Currently enrolled full-time students.
3. Report Time: 5 minutes.
4. Review Experts: Experts from each topic; Professional committee members of the special committee.

*Note:
1.Young scholars can register for both the special session of young scholars' reports and the oral reports of topic simultaneously. Requirement: The report contents for the two scenarios need different. Please indicate the participation content when submitting, and prepare according to the specific requirements of the special session and the topics respectively.